Sites:
Home > Datasheets > Silicone Adhesives and Sealants > Leveling / Filling Compound

Leveling / Filling Compound Silicone Adhesives and Sealants Datasheets

Silicone; bonding & insulating; non-corrosive; lt gray paste; 3 oz tube -- 70125884 - Image
View Datasheet
Silicone; bonding & insulating; non-corrosive; lt gray paste; 3 oz tube -- 70125884 [RTV167-85ML from MG Chemicals]
from Allied Electronics, Inc.

Specific Gravity 1.12, Grey, RTV Silicone Adhesive Sealant. Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable for assembly... [See More]

  • Compound Type: Leveling Filling; Sealant
  • Use Temperature: -76 to 401
  • Features: UL Rating
  • Thermal Conductivity: 0.2100
Similar parts from Allied Electronics, Inc.
View Datasheet
Form-A-Thread®Stripped Thread Kit -- 28654 [28654 from Henkel Corporation]
from Applied Industrial Technologies

Permanently repairs stripped threads and fasteners in five minutes [See More]

  • Compound Type: Leveling Filling; Sealant
  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Composition: Unfilled
Gap Pad VO Soft® - Image
View Datasheet
Gap Pad VO Soft® [Gap Pad VO Soft® from Bergquist Company (The)]
from Quist Electronics

Enhanced puncture, shear and tear resistance, electrically isolating [See More]

  • Compound Type: Leveling Filling; Thermally Conductive
  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Cure / Technology: Thermoset; Contact or Pressure Sensitive Adhesives
Similar parts from Quist Electronics (Show More »)
RTV-1 Silicone Rubber / Adehesive -- ELASTOSIL® N 2010 - Image
View Datasheet
RTV-1 Silicone Rubber / Adehesive -- ELASTOSIL® N 2010
from Wacker Chemical Corp.

ELASTOSIL ® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features. neutral curing system (alkoxy). translucent. sprayable. flowable. primerless adhesion to many substrates. solvent free. Application. [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Similar parts from Wacker Chemical Corp.
It takes just 30 seconds to join.
For full access to this free information, please register now.
Please take
30 seconds to
CLICK HERE to Register
Already registered
with GlobalSpec?
CLICK HERE to Sign In
Members Log-in
 
Your E-mail Address:

Password:
(I forgot my password)
Step 1 of 3Free Registration
 
Required Fields
Required Field
First Name:
Required Fields
Last Name:
Required Fields
E-mail Address:
Required Fields
 
(This will be your login id.)
Password:
Required Fields
Retype Password:
Required Fields
Company Location:
 
Country:
Required Fields
Zip/Postal:
Required Fields
[ You are only seconds away from the Web's largest industrial catalog database ]
   
privacy policy
Step 2 of 3Free Registration
Company:
Required Fields
Address:
Required Fields
 
 
City:
Required Fields
State/Province:
Required Fields
Only required for US and Canada.
State (Other):
 
For addresses outside US or Canada.
Zip/Postal:
Required Fields
Country:
Required Fields

 
privacy policy
Step 3 of 3Free Registration
Job Function:
Required Fields
Industry:
Required Fields
Your Phone:
 
(Optional)
Select Your Free Newsletters
 
Product-specific e-Newsletters
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 
privacy policy