Thermal / Heat Insulating Silicone Adhesives and Sealants Datasheets

Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med
from Master Bond, Inc.

Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]

  • Features: Flexible; High Dielectric; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Composition: Unfilled
Fire Barrier 2000+ Silicone Sealant
from R. S. Hughes Company, Inc.

ASTM E 814, fire rated up to 4 hours, 24" maximum pipe size [See More]

  • Features: Thermal Insulation; UL Rating
  • Composition: Unfilled
  • Compound Type: Sealant
  • Cure / Technology: Thermoset
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Substrate Compatibility: Circuit Boards
  • Compound Type: Adhesive
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
Silastomers® -- 333
from Hernon Manufacturing, Inc.

HERNON Silastomer ® sealants are high performance, single component, moisture curing RTV (room temperature vulcanizing) silicone gasketing materials that cure into a strong, silicone rubber that maintains long term durability and flexibility. They have a non-slumping, paste-like consistency,... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Composition: Unfilled
INSULCAST RTVS 200 RTV Silicone Compound
from ITW Polymer Technologies - Insulcast Division

Flexible Epoxy with Superior Thermal Shock Resistance - ITW INSULGEL 70CC FR NS is an epoxy compound which exhibits superior thermal shock resistance. By making use of an inherently flexible epoxy resin and special filler technology, INSULGEL 70 CC FR NS provides reduced shrinkage and low... [See More]

  • Features: Electrically Conductive; Flame Retardant; Non-corrosive; Thermal Insulation; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Laminaes; Thermal Insulation
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic