Dymax UV Curing Adhesive -- 9-911-REV. A 1 LITER BTL
from Ellsworth Adhesives
from Ellsworth Adhesives
Multi-Cure Dymax 9-911 Rev. A is a high tensile strength material that is especially well suited for fast fixturing, structural wire tacking, and component ruggedization. [See More]
- Features: High Dielectric
- Composition: Unfilled
- Chemical System: Acrylic
- Cure / Technology: UV or Radiation Cured; Single Component
Similar parts from Ellsworth Adhesives
(Show More »)
UV -- OG127-4
from Epoxy Technology
from Epoxy Technology
UV type, insulative conductivity, UV light cure method [See More]
- Features: High Dielectric; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured
- Chemical System: Epoxy
- Type / Form: Liquid
Similar parts from Epoxy Technology
Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.
from Master Bond, Inc.
Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Thermal Management Adhesive -- 3151
from Henkel Corporation - Electronics
from Henkel Corporation - Electronics
Ease-of-use, thermal conductivity [See More]
- Features: High Dielectric; Thermally Conductive
- Composition: Filled
- Chemical System: Acrylic
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Similar parts from Henkel Corporation - Electronics
Gray UV Adhesive -- PNE-90590 (formerly EM 590 UV)
from Protavic America, Inc.
from Protavic America, Inc.
Highly thixotropic UV resin for the manufacture of rings (DAM) into the DAM & FILL process. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Similar parts from Protavic America, Inc.
(Show More »)