Encapsulanting / Potting UV Curing Adhesives Datasheets

UV -- OG116-31
from Epoxy Technology

Product Description: EPO-TEK ® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. EPO-TEK ® OG116-31 Advantages & Application Notes:... [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Flexibilized, One Component UV Curable Adhesive -- UV10FL-1
from Master Bond, Inc.

Master Bond UV10FL-1 and UV10FLTK-1 are a one component UV curable modified compounds, ready for use as supplied, for high performance casting and bonding applications. UV10FL-1 is a low viscosity liquid at room temperature and UV10FLTK-1 is a medium viscosity liquid at room temperature. When... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric
  • Type / Form: Liquid
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Features: Flexible; Encapsulant, Potting Compound; Sealant
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
Ultrabond® -- 736
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component
Gray UV Adhesive -- PNE-90590 (formerly EM 590 UV)
from Protavic America, Inc.

Highly thixotropic UV resin for the manufacture of rings (DAM) into the DAM & FILL process. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic