UV -- OG116-31
from Epoxy Technology

Product Description: EPO-TEK ® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. EPO-TEK ® OG116-31 Advantages & Application Notes:... [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Type / Form: Liquid
Fast Curing, Low Viscosity Silicone -- MS773
from Master Bond, Inc.

Master Bond MasterSil 773 is a ready-to-use one component ultra-low viscosity silicone elastomer based conformal coating which provides excellent protection to electronic circuitry in high humidity environments as well as upon exposure to shock and vibration. It cures quickly at ambient temperatures... [See More]

  • Features: Flexible; Encapsulant, Potting Compound; Sealant
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Type / Form: Liquid
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Features: Flexible; Encapsulant, Potting Compound; Sealant
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
Ultrabond® -- 736
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Anaerobic; UV or Radiation Cured; Single Component
Gray UV Adhesive -- PNE-90590 (formerly EM 590 UV)
from Protavic America, Inc.

Highly thixotropic UV resin for the manufacture of rings (DAM) into the DAM & FILL process. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic