Thermal Compound / Interface (Thermally Conductive) UV Curing Adhesives Datasheets

Cylinlock® -- 821
from Hernon Manufacturing, Inc.

Cylinlock ® 821 is an advanced retaining compound that features anaerobic and ultraviolet light cure. Fixture strength develops in fifteen seconds by exposing the edge fillet of a joint to a high intensity long wavelength ultraviolet light (365 nm). The hidden portion of the assembly will cure... [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: Anaerobic; Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
Gray UV Adhesive -- PNE-90590 (formerly EM 590 UV)
from Protavic America, Inc.

Highly thixotropic UV resin for the manufacture of rings (DAM) into the DAM & FILL process. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic