Photonics / Optoelectronics Specialty Adhesives, Sealants, and Compounds Datasheets

Dow Corning HIPEC R-6101 Silicone Encapsulant 453g Clear -- HIPEC R-6101 PROT CTG 453G
from Ellsworth Adhesives

High purity, one-part, solvent free silicone elastomer. It provides excellent self-priming adhesion to most device surfaces resulting in high-voltage isolation and moisture protection. Documentation: Dow Corning MSDS/TDS [See More]

  • Industry: Electronics; Photonics; OEM or Industrial
  • Cure / Technology: Reactive or Moisture Cured
  • Chemical System: Silicone
  • Features: Encapsulant, Potting Compound
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Industry: Marine; Photonics; OEM or Industrial; Fiber-Optic Applications
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces
  • Composition: Unfilled
Crystalbond™ -- 509
from Aremco Products, Inc.

Odorless, non-flammable, biodegradable water-risible solvent [See More]

  • Industry: Electronics; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoplastic / Hot Melt