Photonics / Optoelectronics Specialty Adhesives, Sealants, and Compounds Datasheets

Dow Corning HIPEC R-6101 Silicone Encapsulant 453g Clear -- HIPEC R-6101 PROT CTG 453G
from Ellsworth Adhesives

High purity, one-part, solvent free silicone elastomer. It provides excellent self-priming adhesion to most device surfaces resulting in high-voltage isolation and moisture protection. Documentation: Dow Corning MSDS/TDS [See More]

  • Industry: Electronics; Photonics; OEM or Industrial
  • Cure / Technology: Reactive or Moisture Cured
  • Chemical System: Silicone
  • Features: Encapsulant, Potting Compound
Cryogenically Serviceable Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; Construction; OEM or Industrial; Semiconductors, IC's; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Polyurethane; Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
Crystalbond™ -- 509
from Aremco Products, Inc.

Odorless, non-flammable, biodegradable water-risible solvent [See More]

  • Industry: Electronics; Photonics; OEM or Industrial
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoplastic / Hot Melt

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