Insulating & Sealing Wrap -- 1212164 [1212164 from Henkel Corporation]
from Applied Industrial Technologies

1" x 10'; Withstands Temperatures Between -65 °F to 500 °F; 700 psi Tensile Strength; 400 vpm Dielectric Strength [See More]

  • Features: High Dielectric; Sealant
  • Cure / Technology: Single Component; Self Fusing
  • Type / Form: Sheet or Film
  • Industry: Automotive; Electric Power; Marine; Plumbing, Industrial
ELAN-Cast® -- E 4260 Black resin / C 321 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; UL Rating
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
Soldering Masking Compound Blue -- 9-20479-B 1 LITER BOTTLE
from Ellsworth Adhesives

DYMAX Ultra Light-Weld 9-20479-B cures upon exposure to light and is designed for rapid masking of electronic components and assemblies. The mask is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. [See More]

  • Features: High Dielectric
  • Chemical System: Acrylic
  • Substrate Compatibility: Printed Circuit Boards
  • Type / Form: Gel
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Adhesive; Anti-static, ESD
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Features: Flexible; High Dielectric; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
Hysol® Encapsulant -- CB011-1R
from Henkel Corporation - Electronics

Self-leveling, one-step cure, meets JEDEC requirements [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Powerseal -- 932
from Hernon Manufacturing, Inc.

Powerseal 932 is a non-curing, single component pipe thread sealant designed for instant seal ability to 600 psi. This versatile sealant is also unaffected by exposure to water, oil, ammonia, glycerin, steam, and all type of gases. Powerseal withstands extreme environmental conditions including... [See More]

  • Features: Flexible; High Dielectric; Sealant; Threadlocker or Retainer
  • Composition: Unfilled
  • Substrate Compatibility: Metal; Plastic; Dissimilar Substrates
  • Cure / Technology: Two Component  ; Non-curing
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Adhesive
  • Chemical System: Ceramic
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
  • Composition: Unfilled