ELAN-Cast® -- E 4260 Black resin / C 321 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; UL Rating
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
Dow Corning 3-4133 Dielectric Gel 210ml Kit -- 3-4133 SILICONE GEL 210ML
from Ellsworth Adhesives

Two-part, Room temp. or heat cure dielectric gel. It is clear and has a long working time. Available Applicators and Mix Nozzle. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Encapsulant, Potting Compound
  • Cure / Technology: Silicone
  • Chemical System: Silicone
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Features: Flexible; Encapsulant, Potting Compound; Laminaes; Sealant; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Features: Encapsulant, Potting Compound; Adhesive
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Unfilled
Circuit Board Protection -- 5088
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Encapsulant, Potting Compound; Sealant
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Filled