from Allied Electronics, Inc.
Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]
- Features: Encapsulant, Potting Compound; Adhesive
- Type / Form: Liquid
- Chemical System: Epoxy
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; UL Rating
- Chemical System: Epoxy
- Substrate Compatibility: Dissimilar Substrates
- Type / Form: Liquid
from Ellsworth Adhesives
Two-part, Room temp. or heat cure dielectric gel. It is clear and has a long working time. Available Applicators and Mix Nozzle. Documentation: Dow Corning MSDS/TDS [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Silicone
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]
- Features: Flexible; Encapsulant, Potting Compound; Laminaes; Sealant; Adhesive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® RT 426 is a pourable, condensationcuring, two-component silicone rubber that vulcanizes at room temperature. Special features. low viscosity. high cured hardness. excellent heat resistance. Application. all-round potting compound [See More]
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Condensation Cured
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Type / Form: Liquid
- Chemical System: Silicone
- Composition: Filled
