Dow Corning 3-6605 Encapsulant Gray 13.6kg Kit -- 3-6605 COND ELAST 13.6KG
from Ellsworth Adhesives

Two part room-temperature or fast thermal cure silicone elastomer, variety of thermal conductivities; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Thermally Conductive; Adhesive
  • Tensile (Break): 850
  • Thermal Conductivity: 0.8500
  • Elongation: 0.9
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Thermally Conductive; Adhesive; Anti-static, ESD
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
Heat-Away™ -- 637
from Aremco Products, Inc.

Thermal grease, offers exceptional thermal and electrical properties [See More]

  • Features: Thermally Conductive; Adhesive
  • Chemical System: Silicone
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
High Thermal K Heat Transfer Epoxy -- 50-3100
from Epoxies Etc...

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]

  • Features: Encapsulant, Potting Compound; Thermally Conductive
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled