Thermal Compound / Interface (Thermally Conductive) Specialty Adhesives, Sealants, and Compounds Datasheets

Dow Corning 3-6605 Encapsulant Gray 13.6kg Kit -- 3-6605 COND ELAST 13.6KG
from Ellsworth Adhesives

Two part room-temperature or fast thermal cure silicone elastomer, variety of thermal conductivities; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: Thermally Conductive; Adhesive
  • Tensile (Break): 850
  • Thermal Conductivity: 0.8500
  • Elongation: 0.9
Flexibilized, Thermally Conductive Epoxy Adhesive -- EP30FLAO
from Master Bond, Inc.

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of... [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermally Conductive; Adhesive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
Heat-Away™ -- 637
from Aremco Products, Inc.

Thermal grease, offers exceptional thermal and electrical properties [See More]

  • Features: Thermally Conductive; Adhesive
  • Chemical System: Silicone
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
High Thermal K Heat Transfer Epoxy -- 50-3100
from Epoxies Etc...

50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]

  • Features: Encapsulant, Potting Compound; Thermally Conductive
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Features: High Dielectric; Flame Retardant; Thermally Conductive; Adhesive
  • Chemical System: Ceramic
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Textiles or Fabrics; Wood; Dissimilar Substrates; Cork, Felt
  • Composition: Unfilled