Non-corrosive Cure Thermoset Adhesives Datasheets

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
Cryogenically Serviceable Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant
  • Chemical System: Epoxy; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
RTV-1 Silicone Rubber / Adhesive and Sealant -- ELASTOSIL® N 2199
from Wacker Chemical Corp.

ELASTOSIL ® N2199 is a one-part, nonslumping paste that cures at room temperature to a permanently flexible silicone rubber on exposure to atmospheric moisture. Special features. neutral curing system (alkoxy). solvent-free. non-slump. excellent unprimed adhesion to many plastic, metal, glass,... [See More]

  • Features: Non-corrosive; Sealant
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; UL Rating
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
  • Composition: Unfilled

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