Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
Chemically Resistant, Two Component Epoxy -- EP30M3LVR
from Master Bond, Inc.

Master Bond Polymer System EP30M3LVR is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Features: Flexible; High Dielectric; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
RTV-1 Silicone Rubber / Adhesive and Sealant -- ELASTOSIL® N 2199
from Wacker Chemical Corp.

ELASTOSIL ® N2199 is a one-part, nonslumping paste that cures at room temperature to a permanently flexible silicone rubber on exposure to atmospheric moisture. Special features. neutral curing system (alkoxy). solvent-free. non-slump. excellent unprimed adhesion to many plastic, metal, glass,... [See More]

  • Features: Non-corrosive; Sealant
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Electrically Conductive Adhesive -- 5420
from Henkel Corporation - Electronics

For bonding temperature sensitive components [See More]

  • Features: Electrically Conductive; Encapsulant, Potting Compound; Non-corrosive; Sealant
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; UL Rating
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
  • Composition: Unfilled