Non-corrosive Cure Thermoset Adhesives Datasheets

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation -- FLM36
from Master Bond, Inc.

Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical... [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; Sealant; Thermally Conductive
  • Type / Form: Sheet or Film; Pellets
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
RTV-1 Silicone Rubber / Adhesive and Sealant -- ELASTOSIL® N 2199
from Wacker Chemical Corp.

ELASTOSIL ® N2199 is a one-part, nonslumping paste that cures at room temperature to a permanently flexible silicone rubber on exposure to atmospheric moisture. Special features. neutral curing system (alkoxy). solvent-free. non-slump. excellent unprimed adhesion to many plastic, metal, glass,... [See More]

  • Features: Non-corrosive; Sealant
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Textiles or Fabrics
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
Silicone Sealant -- RTV 400-100
from Novagard Solutions

Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]

  • Features: High Dielectric; Non-corrosive; Sealant; UL Rating
  • Chemical System: Silicone; Elastomeric
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
  • Composition: Unfilled