POLY-CARB MARK-120
from Dow Polyurethanes

LOW MODULUS HIGH STRENGTH PATCHING SYSTEM FOR CONCRETE A two-component, low modulus, high strength epoxy system and a special blend of properly graded dry silica aggregate. The MARK-120 Patching System provides a chemically inert, highly abrasion resistant surface when applied on a properly prepared... [See More]

  • Industry: Marine; Sanitary; Construction; OEM or Industrial
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry
  • Type / Form: Liquid
EP1026 Clear Epoxy Adhesive -- EP1026 CLEAR 50ML [EP965SC7 CLEAR 50ML from Resinlab]
from Ellsworth Adhesives

Resinlab ® EP 1026 is a clear five minute type epoxy adhesive, tough semi-rigid material and is free flowing in viscosity. 50ml dualpak. [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Electrical -- H20E
from Epoxy Technology

EPO-TEK ® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be... [See More]

  • Industry: Aerospace; Electronics; Sanitary
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal; Plastic
  • Composition: Filled
0Room Temperature Curing Silicone Elastomer -- MS701
from Master Bond, Inc.

Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]

  • Industry: Electronics; Sanitary; Military
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
  • Composition: Unfilled
FDA Approved Compliant Epoxy System -- 10-3033
from Epoxies Etc...

10-3033 is a room temperature curing, two component, epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections... [See More]

  • Industry: Sanitary; OEM or Industrial
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry; Paper or Paperboard; Plastic; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
GSP 1414
from GS Polymers, Inc.

Two part, 1:4, temperatures to 230 °F, good hydrolytic stability, FDA [See More]

  • Industry: Sanitary; OEM or Industrial
  • Chemical System: Epoxy; Elastomeric; Polyurethane
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Variety
  • Composition: Unfilled
Dripstop® -- 950
from Hernon Manufacturing, Inc.

HERNON ® ™s line of Dripstop ® sealants for plumbing, refrigeration and hydraulics are engineered with many advantages over conventional pipe dopes. These materials harden without shrinkage in the joints creating a tough, insoluble, vibration proof seal that will not leak even if... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Military; Construction; OEM or Industrial; Tooling
  • Chemical System: Acrylic
  • Substrate Compatibility: Metal; Plastic; Dissimilar Substrates
  • Composition: Unfilled
High Speed Epoxy Adhesive -- ANE-57103
from Protavic America, Inc.

ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,... [See More]

  • Industry: Automotive; Electronics; Electric Power; Sanitary; Military; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid