Military / Government (MIL-SPEC / GG) Thermoset Adhesives Datasheets

Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000-MP
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Designed specifically to meet the requirements pertaining to the... [See More]

  • Industry: Electronics; Military; Semiconductors, IC's
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Filled
Key #510-LV Low Viscosity Grout & Binder Resin
from Key Resin Company

KEY RESIN #510-CV is a multi-purpose paste consistency epoxy binder used for various KEY COVE BASE SYSTEMS, and as a general purpose spackle or filler compound. This all purpose epoxy resin has excellent thixotropic properties compared to other epoxy formulations, making it ideal for use on vertical... [See More]

  • Industry: Military; OEM or Industrial
  • Chemical System: Epoxy
  • Substrate Compatibility: Concrete, Masonry
  • Cure / Technology: Thermoset
Dimensionally Stable, One Component UV Curable Adhesive -- UV10TK
from Master Bond, Inc.

Master Bond Polymer UV10TK40 is a unique single component, ultra violet curing, ultra violet stable, modified epoxy resin. This product offer the good adhesion, low shrinkage, and good chemical and water resin resistance associated with epoxy systems in general. UV10TK40 cures tack free in the... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Composition: Unfilled
High Speed Epoxy Adhesive -- ANE-57103
from Protavic America, Inc.

ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,... [See More]

  • Industry: Automotive; Electronics; Electric Power; Sanitary; Military; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid