Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Chemical System: Epoxy
  • Substrate Compatibility: Dissimilar Substrates
  • Composition: Filled
EP1026 Clear Epoxy Adhesive -- EP1026 CLEAR 50ML [EP965SC7 CLEAR 50ML from Resinlab]
from Ellsworth Adhesives

Resinlab ® EP 1026 is a clear five minute type epoxy adhesive, tough semi-rigid material and is free flowing in viscosity. 50ml dualpak. [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Electrical -- H35-175MP
from Epoxy Technology

EPO-TEK ® H35-175MP is a single component, silver-filled epoxy for military hybrid die and component attach. [See More]

  • Industry: Aerospace; Electronics; Military
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal; Plastic
  • Composition: Filled
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Composition: Unfilled
0Room Temperature Curing Silicone Elastomer -- MS701
from Master Bond, Inc.

Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]

  • Industry: Electronics; Sanitary; Military
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
  • Composition: Unfilled
Speedline RTV Adhesive/Sealant -- 73-20 Silicone [73-20 Silicone from Speedline Corporation]
from GLT Products (Great Lakes Textiles, Inc.)

Non-slumping paste suitable for overhead or vertical surfaces [See More]

  • Industry: Military; Construction; OEM or Industrial
  • Chemical System: Silicone
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Wood
  • Composition: Unfilled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
High Speed Epoxy Adhesive -- ANE-57103
from Protavic America, Inc.

ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,... [See More]

  • Industry: Automotive; Electronics; Electric Power; Sanitary; Military; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid