from Epoxy Technology
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. [See More]
- Features: Electrically Conductive; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic
- Composition: Filled
from ITW Polymer Technologies - Insulcast Division
INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]
- Features: Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Plastic
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
- Type / Form: Liquid
from GS Polymers, Inc.
Two part, 4:1 flowable, chemical & thermal resistance [See More]
- Features: Thermal Insulation
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
- Composition: Unfilled
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Features: Thermal Insulation
- Type / Form: Gel
- Chemical System: Epoxy
- Composition: Filled
from Protavic America, Inc.
PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]
- Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
- Chemical System: Silicone
- Substrate Compatibility: Metal; Plastic
- Type / Form: Liquid
