Thermal Insulation / Heat Insulating Thermoset Adhesives Datasheets

Electrically Insulative Epoxy -- EPO-TEK® OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
  • Composition: Unfilled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Plastic
  • Type / Form: Liquid
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid