Electrical -- P10
from Epoxy Technology

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. [See More]

  • Features: Electrically Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal; Plastic
  • Composition: Filled
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Plastic
  • Type / Form: Liquid
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
  • Composition: Unfilled
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Features: Thermal Insulation
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Filled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Thermal Insulation
  • Chemical System: Silicone
  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid