Thermal Compound / Interface (Thermally Conductive) Thermoset Adhesives Datasheets

Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Features: Thermally Conductive
  • Composition: Unfilled
  • Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
  • Cure / Technology: Thermoset; Single Component
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Epoxy
  • Substrate Compatibility: Metal; Plastic
  • Composition: Filled
Low Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Thermcoat Cement & Lacquer Kit -- THERMCOAT Series
from OMEGA Engineering, Inc.

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

  • Features: Thermally Conductive
  • Chemical System: Ceramic
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
Thermally Conductive Adhesive -- SEMICOSIL® 971 TC
from Wacker Chemical Corp.

SEMICOSIL ® 971 TC is a non-slump, thermally curable, addition-curing, one part silicone adhesive with excellent thermal conductivity. Special characteristics. Ready-to-use, one-part system. High thermal conductivity. Thixotropic. Rapid heat cure. Primerless adhesion to many substrates. [See More]

  • Features: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Silicone
  • Industry: Electronics
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive; Thermally Conductive
  • Chemical System: Epoxy
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Features: Encapsulant, Potting Compound; Thermally Conductive
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Sealant; Thermally Conductive
  • Chemical System: Acrylic
  • Substrate Compatibility: Ceramic, Glass; Metal; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Gel
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Features: Thermally Conductive
  • Chemical System: Epoxy
  • Substrate Compatibility: Plastic
  • Composition: Filled
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Features: Flexible; Electrically Conductive; Laminaes; Thermally Conductive
  • Type / Form: Gel
  • Substrate Compatibility: Metal; Plastic
  • Composition: Unfilled