VORATRON® Insulators Systems
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Chemical System: Epoxy; Polyurethane
  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: High Dielectric
  • Composition: Filled
3M Scotch-Weld DP270 Epoxy Potting Compound Black 1.7 oz -- DP270 BLACK 1.7OZ DUO-PAK
from Ellsworth Adhesives

3M Scotch-Weld DP270 Black is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. Noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high... [See More]

  • Chemical System: Epoxy
  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  
  • Dielectric Strength: 850
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Hapcast™ 3736 Steel Casting System -- 3736/30
from Hapco, Inc.

HAPCAST ™ 3736 is a room or elevated temperature curing, casting and tooling compound. Steel filled epoxy system. Low viscosity and high density. Good air release and good penetration of all surfaces. Very low shrinkage. Exact reproduction of the original model. Provides excellent durability,... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Cure / Technology: Two Component  
Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose; 1GA -- 079340-39944
from R. S. Hughes Company, Inc.

Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose; 1GA. Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose is one part of a two part epoxy system to be used with a variety of Loctite(R) Hysol(R) hardeners, formulated for general purpose potting and encapsulating applications. [See More]

  • Chemical System: Epoxy; Polyurethane
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric
  • Composition: Filled
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: Anti-static, ESD
  • Cure / Technology: UV or Radiation Cured
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
108783 [ER2074RP250G from Electrolube (A division of HK Wentworth Ltd.)]
from Farnell Europe

ENCAPSULANT, EPOXY, 250G [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 1.26
  • Use Temperature: ? to 266
  • Dielectric Strength: 254
ENCAPTRAX™ 121
from Glotrax Polymers Inc.

A two part epoxy potting compound specially formulated with a 1:1 mix ratio for the convenience of dispensing it from a side-by-side cartridge system. Encaptrax 121 is a flowable, industrial grade potting compound with an extended work life. Once mixed, the epoxy cures at room temperature to form a... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: High Dielectric
  • Composition: Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- ES4212
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Composition: Unfilled