FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Form / Function: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Form / Function: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Form / Function: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- ES6010
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form / Function: Die Bonding Adhesives; Powder; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Ceramic
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled