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FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Form / Function: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Form / Function: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Form / Function: Die Bonding Adhesives; Gel
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Form / Function: Die Bonding Adhesives; Liquid
  • Chemical System: Epoxy; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- ES6010
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled