Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Chemical System: Silicone
  • Type: High Dielectric
  • Composition: Unfilled
Circuit Board Protection -- 5088
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Chemical System: Acrylic
  • Type: High Dielectric; Optical; Thermal Insulation
  • Composition: Unfilled
Silicone Sealant -- RTV 200-107
from Novagard Solutions

Non-corrosive, single component silicone sealant, self-leveling liquid [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Chemical System: Silicone
  • Type: Thermal Insulation
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form / Function: Die Bonding Adhesives; Powder; Gap Filler, Foam in Place Gasket; Liquid
  • Chemical System: Ceramic
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled