from Ellsworth Adhesives
Good low temperature adhesion, high clarity, good resolution properties, excellent mechanical shear stability, makes the interface between itself and the clear substrate invisible. Documentation: Dow Corning MSDS/TDS [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill
- Cure / Technology: Silicone
- Chemical System: Silicone; Silicone
from Master Bond, Inc.
Master Bond Polymer System EP121-1 is a two component high performance epoxy resin compound specially formulated for self crowning (glob-top) and other semiconductor encapsulant applications. It features remarkable resistance to thermal shock and moisture, high substrate adhesion and excellent... [See More]
- Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy; 100% Solids
- Type: High Dielectric
- Composition: Unfilled
from Glotrax Polymers Inc.
AcuDOME is a two part, room temperature curing Polyurethane Resin system that can be applied to many different products and substrates to produce a highly effective 3D "Dome" coating. The application of the resin is easy. AcuDOME is supplied in easy to use, manually applied cartridges or in bulk for... [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill; Liquid
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Two Component
from Henkel Corporation - Electronics
Self-leveling, one-step cure, meets JEDEC requirements [See More]
- Form / Function: Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Liquid
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Novagard Solutions
Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]
- Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Chemical System: Silicone; Elastomeric
- Type: High Dielectric
- Composition: Unfilled
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Form / Function: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill; Liquid
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
