Glob Top / Daub Encapsulants and Potting Compounds Datasheets

Glob Top Epoxy -- EPO-TEK® T7139
from Epoxy Technology

EPO-TEK ® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. [See More]

  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Filled
HYSOL EO1086 -- 8799551094785
from Henkel Corporation - Electronics

HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties. [See More]

  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Industry: Electronics
One Component, UV Curable Glob Top Compound -- UV15X-2GT
from Master Bond, Inc.

Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
AcuDome™
from Glotrax Polymers Inc.

AcuDOME is a two part, room temperature curing Polyurethane Resin system that can be applied to many different products and substrates to produce a highly effective 3D "Dome" coating. The application of the resin is easy. AcuDOME is supplied in easy to use, manually applied cartridges or in bulk for... [See More]

  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled