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Dow Corning Q2-3067 Optical Encapsulant Couplant 113g -- Q2-3067 OPT COUPLANT 113G
from Ellsworth Adhesives

Good low temperature adhesion, high clarity, good resolution properties, excellent mechanical shear stability, makes the interface between itself and the clear substrate invisible. Documentation: Dow Corning MSDS/TDS [See More]

  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Cure / Technology: Silicone
  • Chemical System: Silicone; Silicone
Optical -- 301
from Epoxy Technology

Product Description: EPO-TEK ® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK ® 301 Advantages & Suggested Application Notes: • Semiconductor: optical glob top or underfill; adhesion to common... [See More]

  • Form / Function: Glob Top, Daub, Doming or Overfill; Liquid
  • Chemical System: Epoxy
  • Type: Optical
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
One Component, UV Curable Glob Top Compound -- UV15X-2GT
from Master Bond, Inc.

Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
AcuDome™
from Glotrax Polymers Inc.

AcuDOME is a two part, room temperature curing Polyurethane Resin system that can be applied to many different products and substrates to produce a highly effective 3D "Dome" coating. The application of the resin is easy. AcuDOME is supplied in easy to use, manually applied cartridges or in bulk for... [See More]

  • Form / Function: Glob Top, Daub, Doming or Overfill; Liquid
  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Cure / Technology: Two Component  
Hysol® Encapsulant -- CB011R-3
from Henkel Corporation - Electronics

Self-leveling, one-step cure, meets JEDEC requirements [See More]

  • Form / Function: Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Liquid
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Silicone Sealant -- RTV 500-100
from Novagard Solutions

Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]

  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Form / Function: Die Bonding Adhesives; Glob Top, Daub, Doming or Overfill; Liquid
  • Chemical System: Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled