734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Industry: Automotive; Electronics; Compressors, Gear Boxes, Pumps
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Form / Function: Liquid
  • Features: UL Rating
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Industry: Marine; Electronics; Military; OEM or Industrial
  • Form / Function: Liquid
  • Type: Thermal Insulation
  • Chemical System: Epoxy
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Industry: Electronics; Photonics; Semiconductors, IC's
  • Form / Function: Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Fast Curing, One Component Silicone -- MS711
from Master Bond, Inc.

Master Sil 711 is a ready-to use, exceptionally fast curing, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound is self leveling and can be readily applied to various surfaces. It cures at ambient... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Composition: Unfilled
Techspray Fine-L-Kote AR Conformal Coating - 12 oz - 12 Per Case -- 2103-12S
from R. S. Hughes Company, Inc.

Techspray Fine-L-Kote AR Conformal Coating - 12 oz - 12 Per Case. Acrylic Conformal Coating is an economical choice that provides a hard protective surface. Commonly used on aviation components. [See More]

  • Industry: Electronics
  • Form / Function: Spray; Encapsulant or Conformal Coating
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Industry: Automotive; Electronics
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric
  • Chemical System: Epoxy
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: Anti-static, ESD
  • Chemical System: Epoxy
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Composition: Unfilled
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Type: High Dielectric
  • Chemical System: Silicone
Circuit Board Protection -- 3900
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Industry: Electronics
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: Thermal Insulation
  • Chemical System: Acrylic
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Printed Circuit Boards
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Acrylic
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: Thermal Insulation
  • Chemical System: Silicone
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Die Bonding Adhesives; Powder; Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic