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5-Minute® Epoxy -- 14200 [14200 from ITW Devcon]
from Applied Industrial Technologies

15 oz Tube; A Rapid-Curing, General Purpose Adhesive/Encapsulant [See More]

  • Industry: OEM or Industrial
  • Composition: Unfilled
  • Form / Function: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
3M Scotch-Weld DP270 Epoxy Potting Compound Black 1.7 oz -- DP270 BLACK 1.7OZ DUO-PAK
from Ellsworth Adhesives

3M Scotch-Weld DP270 Black is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. Noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high... [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Dielectric Strength: 850
UV -- OG154-1
from Epoxy Technology

Single component, UV curable epoxy for adhesive sealing and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. Replacement for EPO-TEK OG154. [See More]

  • Industry: Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Epoxy
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Gel
  • Composition: Filled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Industry: Marine; Photonics; OEM or Industrial; Fiber-Optic Applications
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
RTV-1 Silicone Rubber / Adehesive -- ELASTOSIL® N 2010
from Wacker Chemical Corp.

ELASTOSIL ® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features. neutral curing system (alkoxy). translucent. sprayable. flowable. primerless adhesion to many substrates. solvent free. Application. [See More]

  • Industry: OEM or Industrial
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric
  • Chemical System: Epoxy
Lab-metal
from Dampney Company, Inc.

Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal. [See More]

  • Industry: Marine; Automotive; Construction; OEM or Industrial
  • Composition: Filled
  • Chemical System: Aluminum-filled Compound
  • Use Temperature: -40 to 350
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: Anti-static, ESD
  • Chemical System: Epoxy
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Type: High Dielectric
  • Chemical System: Silicone
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Industry: OEM or Industrial
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
Circuit Board Protection -- US5502
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Industry: Marine; Automotive; Electronics; Military; OEM or Industrial
  • Chemical System: Polyurethane
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Printed Circuit Boards
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Acrylic
LED Encapsulant
from LG Chemical of America Inc.

LG Chem launched its first LED encapsulant in 2012 and has been focusing on developing highly efficient, highly reliable products through continuous research and development. [See More]

  • Industry: OEM or Industrial
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: Thermal Insulation
  • Chemical System: Silicone