Optoelectronics / Photonics Encapsulants and Potting Compounds Datasheets

Clear, UV Curable Adhesive -- EPO-TEK® UJ1190
from Epoxy Technology

Clear, UV curable adhesive. [See More]

  • Industry: Photonics; Semiconductors, IC's
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Epoxy
Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Industry: Marine; Sanitary; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric; Optical; Thermal Insulation
  • Composition: Unfilled
Silicone Resin Powder -- SILRES® H 44
from Wacker Chemical Corp.

SILRES ® H44 is a powdered silicone resin with excellent solubility in various organic solvents and good compatibility with organic resins. Special features. solvent-free, solid phenylmethyl polysiloxane resin. high solubility in organic solvents. fast curing in the presence of catalysts. [See More]

  • Industry: Electronics; Photonics
  • Chemical System: Silicone
  • Form / Function: Pellets
  • Cure / Technology: Single Component
Water Clear Optical Grade Epoxy -- 20-3238
from Epoxies Etc...

20-3238 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for L.E.D. encapsulating, fiber optic applications and any potting application requiring the optimum clarity for inspection. [See More]

  • Industry: Electronics; Photonics
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Epoxy
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Encapsulant or Conformal Coating; Gel; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone