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734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Features: UL Rating
  • Form / Function: Liquid
  • Industry: Automotive; Electronics; Compressors, Gear Boxes, Pumps
Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Impregnating Resin; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
CONATHANE® EN-1556 Kit Black -- EN-1556 BLACK GAL
from Ellsworth Adhesives

CONATHANE EN-1556 is a polyether based, non-MBOCA, polyurethane resin system. EN-1556, when fully cured, is a tough, cold-flow resistant elastomer that has good resistance to oils, gasoline, JP-4 fuel, water and sea water. Kit contains of 1 Gallon of Part A and 1/2 Gallon of Part B. [See More]

  • Cure / Technology: Single Component; Polyurethane
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Industry: Electronics; Semiconductors, IC's
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Sympoxy™ 1960/1961G Epoxy for Potting, Casting, and Encapsulation Applications -- 1960/1961G
from Hapco, Inc.

Sympoxy ™ is a lightweight powder that is both versatile and extremely easy to use. Items being potted are filled to the desired level, preferrably while vibrated to minimalize voids, and then cured with heat when ready. If the cured powder is to be an exterior surface, it may be coated with a... [See More]

  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Function: Powder
  • Features: Flame Retardant; UL Rating
INSULCAST 781 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 781 is a clear, one-component, flexible, heat cure epoxy system designed for coil impregnation, and potting applications requiring low viscosity and minimal thermal stress. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Impregnating Resin; Liquid
  • Composition: Unfilled
0Room Temperature Curing Silicone Elastomer -- MS701
from Master Bond, Inc.

Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Form / Function: Encapsulant or Conformal Coating
  • Type: High Dielectric
  • Chemical System: Silicone
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
LightSwitch™ Encapsulant -- Frontsheet ETFE
from Saint-Gobain Plastic Films and Tapes

LightSwitch ™ Encapsulant. LightSwitch ™ Encapsulant provides cushioning and structural support to solar cells and circuitry, while maximizing transmission of sunlight for energy conversion. With outstanding weathering properties, it protects the solar module throughout its lifecycle. [See More]

  • Cure / Technology: Single Component; Melt Processable Fluoropolymer
  • Industry: Solar
  • Chemical System: ETFE
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured (optional feature); Room Temperature Vulcanizing or Curing
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Circuit Board Protection -- 3900
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: Thermal Insulation
  • Chemical System: Acrylic
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Acrylic
Epoxy Potting Compound -- E112
from Koford Engineering, LLC

E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the epoxy will... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 320 to 392
  • Form / Function: Liquid
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Type: Thermal Insulation
  • Chemical System: Silicone