from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Epoxy Potting Compound DP270 is a rigid, two-part epoxy adhesive potting compound. 1:1 mix ratio, 70 minute work life and handling strength in approximately 3 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator and mix nozzles are required (not... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Function: Liquid
- Industry: Electronics; Military; Construction; OEM or Industrial
from Andover Corporation
Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200 °F and is available in premeasured kits. USES. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Optical
- Industry: Photonics
from Applied Industrial Technologies
453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing; Cure By Methanol
- Industry: General Purpose
- Chemical System: Silicone; Elastomeric
- Use Temperature: -65 to 390
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
- Chemical System: Silicone
- Form / Function: Encapsulant or Conformal Coating; Liquid
- Industry: Electronics
from Dow Polyurethanes
Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Polyurethane; Polyether Polyol
- Form / Function: Gel
- Features: Water Based
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid
- Type: High Dielectric
- Chemical System: Epoxy
from Ellsworth Adhesives
CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: Thermal Insulation
- Chemical System: Epoxy
from Epoxy Technology
EPO-TEK ® EP110-R1 is a silver-filled epoxy which is similar to EPO-TEK ® E4110, designed for potting and casting applications. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type: Electrically Conductive
- Composition: Filled
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Industry: Electronics
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Function: Die Bonding Adhesives; Gel
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Composition: Unfilled
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
- Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
from Quist Electronics
Bonded laminate, copper shield between layers or Sil-Pad [See More]
- Cure / Technology: Two Component
- Form / Function: Bonded Laminate
- Type: High Dielectric; EMI/RFI Shielding; Thermally Conductive
- Chemical System: Elastomeric
from R. S. Hughes Company, Inc.
RTV11 - White (1 g). RTV11 is a general purpose two-part silicone elastomer. It is supplied ready-to-use with a base compound and DBT (dibutyl tin dilaurate) as the standard curing agent. DBT is suitable for most applications, however other catalysts are available to facilitate deep section cure,... [See More]
- Cure / Technology: Two Component
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Form / Function: Die Bonding Adhesives; Powder; Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
from Wacker Chemical Corp.
ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Form / Function: Liquid
- Industry: Electronics
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Cure / Technology: Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
- Type: High Dielectric
- Chemical System: Silicone
from GS Polymers, Inc.
Two part, general purpose potting compound and adhesive [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Function: Die Bonding Adhesives
- Composition: Unfilled
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Filled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
