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3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Black, 1.7 fl oz, 12 per case -- 62326614351
from 3M Industrial Adhesives & Tapes Canada

3M ™ Scotch-Weld ™ Epoxy Potting Compound DP270 is a rigid, two-part epoxy adhesive potting compound. 1:1 mix ratio, 70 minute work life and handling strength in approximately 3 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator and mix nozzles are required (not... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Industry: Electronics; Military; Construction; OEM or Industrial
Conap™ Conformal Coating -- CONATHANE® CE-1155
from ACCRAbond, Inc.

CONATHANE ® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Form / Function: Encapsulant or Conformal Coating
  • Features: Solvent Based
3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Industry: General Purpose
  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -65 to 390
VORANOL™ -- 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane; Polyether Polyol
  • Form / Function: Gel
  • Features: Water Based 
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: Thermal Insulation
  • Chemical System: Epoxy
Electrically Insulative and Thermally Conductive Epoxy -- TV2001
from Epoxy Technology

A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Industry: Electronics
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Gel
  • Composition: Filled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
Sil-Pad® Shield [Sil-Pad® Shield from Bergquist Company (The)]
from Quist Electronics

Bonded laminate, copper shield between layers or Sil-Pad [See More]

  • Cure / Technology: Two Component  
  • Form / Function: Bonded Laminate
  • Type: High Dielectric; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Elastomeric
RTV11 - White (1 g) -- RTV11 WHITE 012
from R. S. Hughes Company, Inc.

RTV11 - White (1 g). RTV11 is a general purpose two-part silicone elastomer. It is supplied ready-to-use with a base compound and DBT (dibutyl tin dilaurate) as the standard curing agent. DBT is suitable for most applications, however other catalysts are available to facilitate deep section cure,... [See More]

  • Cure / Technology: Two Component  
Primerless Silicone Encapsulant -- ELASTOSIL® RT 745
from Wacker Chemical Corp.

ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Industry: Electronics
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Composition: Unfilled
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Cure / Technology: Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Type: High Dielectric
  • Chemical System: Silicone
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
Circuit Board Protection -- ES4212
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Type: High Dielectric
  • Chemical System: Epoxy
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone