ESD Control / Anti-static Encapsulants and Potting Compounds Datasheets

Henkel Loctite GC 10 Solder Paste -- Gray 500 g Jar
from Ellsworth Adhesives

Henkel Loctite GC 10 Solder Paste offers excellent solderability on challenging surface finishes. It features halogen-free flux, low voiding, and fine pitch capability. It provides long term stability over a wide range of temperature conditions. 500 g Jar. [See More]

  • Type: Anti-static, ESD; Electrically Conductive
  • Cure / Technology: Single Component
  • Form / Function: Paste
  • Industry: Electronics
Clear, Low Viscosity Epoxy Compound -- EP28-1
from Master Bond, Inc.

Master Bond EP28-1 is a clear, low viscosity two-component high impactepoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals and nonmetallics including ceramics, glass and many plastics. It features excellent flowability... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Type: Anti-static, ESD
  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: UV or Radiation Cured