Filled Encapsulants and Potting Compounds Datasheets

ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Filled
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
Glob Top Epoxy -- EPO-TEK® T7139
from Epoxy Technology

EPO-TEK ® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. [See More]

  • Composition: Filled
  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
  • Cure / Technology: Two Component  
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Composition: Filled
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric
  • Chemical System: Epoxy
Hi-Temp Lab-metal
from Dampney Company, Inc.

Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF. [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset
  • Chemical System: Aluminum-filled Compound
  • Industry: Automotive; Construction; Welding
Epoxy Potting and Encapsulating Compound -- 20-3650
from Epoxies Etc...

20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat. [See More]

  • Composition: Filled
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
GSP 1331-1
from GS Polymers, Inc.

Two part, 1:1, provides low stress on internal components, long open time [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Features: Dissimilar Substrates
Hapcast™ 3732 All Purpose High Temperature Aluminum Casting System -- 3732/14
from Hapco, Inc.

Our best aluminum filled, all-purpose tooling compound. A unique polymer alloy system with the following features: Short-term exposure to 400 °F, and continuous service at 325 °F is possible with this system. Provides excellent heat transfer properties. Easily mixed and poured at room... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Use Temperature: 300
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Form / Function: Gel; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Composition: Filled
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane