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ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
CONATHANE® EN-20 -- EN-20 GAL KIT
from Ellsworth Adhesives

CONATHANE EN-20 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. Gallon kit. [See More]

  • Type: High Dielectric
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Gel
  • Composition: Unfilled
Flexible Epoxy Features High Shear and Peel Strength -- EP40
from Master Bond, Inc.

Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel strength. It features excellent adhesion to engineering plastics as well as metals and various other... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured (optional feature); Room Temperature Vulcanizing or Curing
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Composition: Filled
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy; Elastomeric
  • Form / Function: Die Bonding Adhesives; Liquid
  • Composition: Unfilled
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Composition: Unfilled
Hysol® Electronic Coating Compound -- DK18-05
from Henkel Corporation - Electronics

Reliable moisture performance [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Form / Function: Powder; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Single Component
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Acrylic
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Filled