Electrically Conductive Encapsulants and Potting Compounds Datasheets

Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy; Polyurethane
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
INSULCAST LN 1-05 Epoxy Potting Compound
from ITW Polymer Technologies - Insulcast Division

Crack Resistant Epoxy Potting and Encapsulation Compounds - ITW INSULCAST LN 1-05 is a highly crack resistant epoxy compound specifically designed for large potting and encapsulation applications. It displays excellent electrical properties over a wide range of temperatures. INSULCAST LN 1-05 make... [See More]

  • Type: Electrically Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled