Electrically Conductive Encapsulants and Potting Compounds Datasheets

High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Type: High Dielectric (optional feature); Electrically Conductive (optional feature)
  • Chemical System: Epoxy; 100% Solids
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Composition: Unfilled
INSULCAST LN 1-05 Epoxy Potting Compound
from ITW Polymer Technologies - Insulcast Division

Crack Resistant Epoxy Potting and Encapsulation Compounds - ITW INSULCAST LN 1-05 is a highly crack resistant epoxy compound specifically designed for large potting and encapsulation applications. It displays excellent electrical properties over a wide range of temperatures. INSULCAST LN 1-05 make... [See More]

  • Type: Electrically Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled