Electrically Conductive Encapsulants and Potting Compounds Datasheets

Henkel Loctite GC 10 Solder Paste -- Gray 500 g Jar
from Ellsworth Adhesives

Henkel Loctite GC 10 Solder Paste offers excellent solderability on challenging surface finishes. It features halogen-free flux, low voiding, and fine pitch capability. It provides long term stability over a wide range of temperature conditions. 500 g Jar. [See More]

  • Type: Anti-static, ESD; Electrically Conductive
  • Cure / Technology: Single Component
  • Form / Function: Paste
  • Industry: Electronics
Clear, Low Viscosity Epoxy Compound -- EP28-1
from Master Bond, Inc.

Master Bond EP28-1 is a clear, low viscosity two-component high impactepoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals and nonmetallics including ceramics, glass and many plastics. It features excellent flowability... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Unfilled
INSULCAST LN 1-05 Epoxy Potting Compound
from ITW Polymer Technologies - Insulcast Division

Crack Resistant Epoxy Potting and Encapsulation Compounds - ITW INSULCAST LN 1-05 is a highly crack resistant epoxy compound specifically designed for large potting and encapsulation applications. It displays excellent electrical properties over a wide range of temperatures. INSULCAST LN 1-05 make... [See More]

  • Type: Electrically Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled