EMI / RFI Shielding Material Encapsulants and Potting Compounds Datasheets
from Master Bond, Inc.
Master Bond Polymer System EP30M3LVR is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]
- Type: High Dielectric; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
- Composition: Filled