EMI / RFI Shielding Material Encapsulants and Potting Compounds Datasheets
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy; Polyurethane
- Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
- Composition: Filled