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3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: General Purpose
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Use Temperature: -65 to 390
VORANOL™ -- 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane; Polyether Polyol
  • Features: Water Based 
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
CONAPOXY® FR-1047 Epoxy -- FR-1047 BLACK 5-GAL
from Ellsworth Adhesives

CONAPOXY FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy, excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. 5 gallon. [See More]

  • Type: Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
INSULCAST 116 FR-FC-FS Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC-FS is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC-FS is among the safest epoxy compounds... [See More]

  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant
Fast Curing, One Component Silicone -- MS711
from Master Bond, Inc.

Master Sil 711 is a ready-to use, exceptionally fast curing, one component high performance silicone elastomer compound for bonding, sealing, protective coatings and formed-in-place gaskets. This compound is self leveling and can be readily applied to various surfaces. It cures at ambient... [See More]

  • Form / Function: Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE -- 079340-17614
from R. S. Hughes Company, Inc.

LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE. [See More]

  • Chemical System: Silicone
LightSwitch™ Encapsulant -- Frontsheet ETFE
from Saint-Gobain Plastic Films and Tapes

LightSwitch ™ Encapsulant. LightSwitch ™ Encapsulant provides cushioning and structural support to solar cells and circuitry, while maximizing transmission of sunlight for energy conversion. With outstanding weathering properties, it protects the solar module throughout its lifecycle. [See More]

  • Chemical System: ETFE
  • Industry: Solar
  • Cure / Technology: Single Component; Melt Processable Fluoropolymer
Fluoro Silicone Gel -- SEMICOSIL® 927 F
from Wacker Chemical Corp.

SEMICOSIL ® 927F is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber that cures to a soft silicone gel. Special characteristics. One-part, ready-to-use. Thixotropic behavior. Rapid heat cure. Very low hardness (gel). Outstanding resistance to chemicals. [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Viscosity: 2500 to 6000
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Composition: Filled
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Industry: Electronics
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Type: Anti-static, ESD
  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: UV or Radiation Cured
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Form / Function: Gel
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
101697 [1673921 from Dow Corning Analytical Solutions]
from Farnell Europe

ELASTOMER, 184, KIT, 1.1KG [See More]

  • Chemical System: Silicone
  • Tensile (Break): 899
  • Use Temperature: -67 to 392
  • Elongation: 100.0
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Composition: Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- 3900
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Type: Thermal Insulation
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Composition: Unfilled
Epoxy Potting Compound -- E112
from Koford Engineering, LLC

E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the epoxy will... [See More]

  • Form / Function: Liquid
  • Use Temperature: 320 to 392
  • Cure / Technology: Thermoset; Single Component
LED Encapsulant
from LG Chemical of America Inc.

LG Chem launched its first LED encapsulant in 2012 and has been focusing on developing highly efficient, highly reliable products through continuous research and development. [See More]

  • Industry: OEM or Industrial
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Type: Thermal Insulation
  • Chemical System: Silicone
  • Form / Function: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled