Encapsulant / Potting Compound Encapsulants and Potting Compounds Datasheets

3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: General Purpose
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Use Temperature: -65 to 390
High Reactivity Capped Polyether Triol With Nominal Molecular Weight of 4800 -- VORANOL™ 232-034
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane; Polyether Polyol
  • Features: Water Based 
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
3M Scotch-Weld DP270 Epoxy Potting Compound Black 1.7 oz Duo-Pak Cartridge -- DP270 BLACK 1.7OZ DUO-PAK [62326614351 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
Hysol 3329 -- 8802594848769
from Henkel Corporation - Electronics

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]

  • Industry: Electronics
  • Viscosity: 8000
  • CTE: 25
Hysol PC62
from Henkel Corporation - Industrial

Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications. [See More]

  • Chemical System: Acrylic
  • Use Temperature: -40 to 257
  • Cure / Technology: Single Component
  • Viscosity: 50
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Use Temperature: -60 to 400
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
1213877.0
from RS Components, Ltd.

The Raytech Isaac 4 and Isaac 4MP are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. Package Type = Blister. [See More]

  • Use Temperature: 194
Castable, Addition-curing, Two-component Silicone Rubber -- ELASTOSIL® RT646 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 646 A/B is a castable, additioncuring, two-component silicone rubber which vulcanizes at room temperature. Special features. high hardness and good mechanical properties. good chemical resistance. good resistance to casting resins. excellent reversion resistance. fast and... [See More]

  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
Conap™ Epoxy Potting & Casting Compound -- CONAPOXY® FR-1046
from ACCRAbond, Inc.

CONAPOXY ® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation properties. When cured with any of the hardeners presented below, a hardness... [See More]

  • Chemical System: Epoxy
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Composition: Filled
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Industry: Electronics
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Type: Anti-static, ESD
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: UV or Radiation Cured
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Form / Function: Gel
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
101697 [1673921 from Dow Corning Analytical Solutions]
from Farnell Europe

ELASTOMER, 184, KIT, 1.1KG [See More]

  • Chemical System: Silicone
  • Tensile (Break): 899
  • Use Temperature: -67 to 392
  • Elongation: 100.0
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Composition: Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Composition: Unfilled
INSULCAST 116 FR-FC-FS Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC-FS is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC-FS is among the safest epoxy compounds... [See More]

  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant
Epoxy Potting Compound -- E112
from Koford Engineering, LLC

E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the epoxy will... [See More]

  • Form / Function: Liquid
  • Use Temperature: 320 to 392
  • Cure / Technology: Thermoset; Single Component
OLED Encapsulant
from LG Chemical of America Inc.

OLED Encapsulant. LG Chem developed the OLED Encapsulant that is superior to the existing packing material. LG Chem developed the face seal OLED Encapsulant whose performance is superior to the existing packing materials, improving the lifespan of an OLED display element drastically. [See More]

Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Type: Thermal Insulation
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled