Thermal Compound / Thermally Conductive Encapsulants and Potting Compounds Datasheets

Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid; Impregnating Resin
  • Composition: Filled
Electrically Insulative and Thermally Conductive Epoxy -- EPO-TEK® TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
LOCTITE ECCOBOND FP5001 (Known as Hysol FP5001) -- 8799534219265
from Henkel Corporation - Electronics

Known as Hysol FP5001 ). LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to thermal cycling. [See More]

  • Type: Thermally Conductive
  • Viscosity: 25000 to 75000
  • Industry: Electronics
LOCTITE CAT 14
from Henkel Corporation - Industrial

Known as HYSOL STYCAST 2762-Catalyst 14 ). LOCTITE CAT 14 is a two component high thermal conductivity epoxy encapsulant for electronic components exposed to harsh environments. This material is also ideal for large and complex castings that require high temperature resistance and thermal... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant; UL Rating
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Tuffbond™ -- 313
from Hernon Manufacturing, Inc.

Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies... [See More]

  • Type: High Dielectric; Thermally Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Composition: Unfilled
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Gel
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled