Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Impregnating Resin; Liquid
  • Composition: Filled
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket
  • Composition: Filled
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Encapsulant or Conformal Coating; Liquid (optional feature)
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Cure / Technology: Thermoset; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane; Castor/MDI
  • Form / Function: Encapsulant or Conformal Coating; Liquid
  • Composition: Filled
Tuffbond™ -- 313
from Hernon Manufacturing, Inc.

Tuffbond epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. Tuffbond epoxies... [See More]

  • Type: High Dielectric; Thermally Conductive; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Gel
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Die Bonding Adhesives; Encapsulant or Conformal Coating; Liquid
  • Composition: Unfilled