from Device Technologies, Inc.
Device Technologies, Inc. has been designing and manufacturing high performance wire protection, cable management, and other specialty fasteners for over two decades. It ’s standard products include Spring-Fast ® Wire Protection Grommet Edging, Trim-Fast ™ Edge Trim, Seal-Fast... [See More]
- Chemical System: Epoxy
- Cure / Technology: UV or Radiation Cured; Single Component
- Type: High Dielectric
- Form / Shape: Powder
from Ellsworth Adhesives
One-part, medium viscosity; ozone-safe (VOC exempt) solvent borne, elastoplastic silicone resin; excellent abrasion resistance. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]
- Chemical System: Silicone; Silicone
- Industry: Aerospace; Automotive; Electronics; Military; Photonics; OEM or Industrial
- Cure / Technology: Low VOC
- Viscosity: 1250
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Chemical System: Epoxy; 100% Solids
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Sauereisen, Inc.
Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]
- Chemical System: Ceramic; Sodium Silicate Adhesive Cement
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Chemical System: Polyurethane; MDI
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Form / Shape: Liquid
from Protavic America, Inc.
Fluid UV resin for fill application. [See More]
- Type: Thermally Conductive; High Dielectric
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Composition: Unfilled
- Form / Shape: Liquid
