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Dow Corning 1-2577 Low VOC Silicone Conformal Coating 408g -- 1-2577 LOW VOC CTG 408G
from Ellsworth Adhesives

One-part, medium viscosity; ozone-safe (VOC exempt) solvent borne, elastoplastic silicone resin; excellent abrasion resistance. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]

  • Chemical System: Silicone; Silicone
  • Industry: Aerospace; Automotive; Electronics; Military; Photonics; OEM or Industrial
  • Cure / Technology: Low VOC
  • Viscosity: 1250
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Chemical System: Epoxy; 100% Solids
  • Composition: Unfilled
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Aremco-Seal™ -- 613
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Chemical System: Ceramic; Glass
  • Composition: Filled
  • Type: High Dielectric
  • Form / Shape: Liquid
Circuit Board Protection -- US5517
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Chemical System: Polyurethane; MDI
  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Form / Shape: Liquid
Gray UV Encapsulant -- PNE-90290
from Protavic America, Inc.

Fluid UV resin for fill application. [See More]

  • Type: Thermally Conductive; High Dielectric
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Composition: Unfilled
  • Form / Shape: Liquid