Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Form / Shape: Liquid
Dymax UV Curing Adhesive -- 9-20557 15 LITER PAIL
from Ellsworth Adhesives

Dymax Multi-Cure 9-20557 foams a tough clear circuit encapsulant upon exposure to long-wave UV light or visible light. Coating resists yellowing, vibration, impact and thermal shock. [See More]

  • Type: Conformal Coating; High Dielectric
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: UV or Radiation Cured; Single Component
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Type: Thermally Conductive; High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy; 100% Solids
  • Cure / Technology: Thermoset; Single Component
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: Thermally Conductive; High Dielectric
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature)
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Shape: Liquid
Aremco-Seal™ -- 529
from Aremco Products, Inc.

Exceptional electrical, moisture & chemical resistance [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone
  • Form / Shape: Liquid
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Two Component  
Hysol® Electronic Coating Compound -- DK18-05
from Henkel Corporation - Electronics

Reliable moisture performance [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Form / Shape: Powder
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Type: Optical; High Dielectric
  • Composition: Unfilled
  • Chemical System: Acrylic
  • Cure / Technology: UV or Radiation Cured; Single Component
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Silicone; Elastomeric
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component