Clear, Low Viscosity Epoxy Compound -- EP28-1
from Master Bond, Inc.

Master Bond EP28-1 is a clear, low viscosity two-component high impactepoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals and nonmetallics including ceramics, glass and many plastics. It features excellent flowability... [See More]

  • Type: Electrically Conductive; High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Electrically Conductive Adhesive -- 5420
from Henkel Corporation - Electronics

For bonding temperature sensitive components [See More]

  • Type: Electrically Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component