Abrasion Resistant UV Curable Coating System -- UV11-3
from Master Bond, Inc.

Master Bond UV14-3 is a new one component, flexible, UV curable polymer system for bonding, sealing and coating with the convenient feature of being readily removable by most conventional solvents. It is a 100% reactive, moderate viscosity liquid at ambient temperatures which does not contain any... [See More]

  • Features: Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Type: Optical; High Dielectric
  • Form / Shape: Liquid
Circuit Board Protection -- 3900
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Thermal Insulation
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Thermoset; Single Component
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Features: Non-corrosive; Phase Change; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: Optical; High Dielectric
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component