Thermal / Heat Insulating Conformal Coatings Datasheets

Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Polycure -- 744
from Hernon Manufacturing, Inc.

Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]

  • Features: Non-corrosive; Phase Change; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Acrylic
  • Type: High Dielectric; Optical
  • Composition: Unfilled
INSULCAST 985 FR Semi-Flexible Flame Retardant Epoxy Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 985 FR is a semi-flexible flame retardant epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound, as well as excellent electrical properties over a wide range of temperatures. INSULCAST 985 FR makes use of the latest polymer and filler... [See More]

  • Features: Flame Retardant; Thermal Insulation; UL Rating
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component

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