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Fixed Inductors -- 399-9548-1-ND [L0201C10NJRMST from KEMET Electronics Corporation]
from Digi-Key Corporation

INDUCTOR HI FREQ 10NH 5% 0201 [See More]

  • Application: High Frequency
  • Standards and Certifications: RoHS
  • Packing Method: Tape Reel
  • Inductance Range: 0.0100
High Frequency Inductor, Multilayer Chip -- TF060303-0N3
from Frontier Electronics Corp.

SMD Ceramic Multilayer Chip Inductor TF060303-0N3 , 0.3 nH , Non-Coated, Unshielded [See More]

  • Application: High Frequency
  • Core Material: Ceramic
  • Technology: Multilayer
  • Inductance Range: 3.00E-4
Chip Inductors -- ELJ-QF Series
from Panasonic

ELJ-QF Series High-Q Series Laser-Cut Chip Inductors. Now Available In Industry Standard E-24 (1.1 to 36nH) Value Series. The ELJ-QF Series laser-cut devices now bring an enhanced level of high frequency performance and high Self Resonant Frequency to circuits and multi GHz operation with values... [See More]

  • Application: High Frequency
  • Molded / Shielded: Shielded
  • Core Material: Ceramic
  • Standards and Certifications: RoHS
TE Connectivity 1-1624108-0 Passive Electronic Components -- 1-1624108-0 [1-1624108-0 from TE Connectivity]
from Powell Electronics, Inc.

Converted to EU RoHS/ELV Compliant Reflow solder capable to 260 °C [See More]

  • Application: High Frequency
  • Packing Method: Tape Reel
  • Technology: Thin Film
  • EIA Case Size: 1.5 x 0.5
Multilayer Ceramic Inductor -- Model MHI0402C10N
from AEM, Inc.

Monolithic structure, used in high frequency equipment [See More]

  • Application: General Purpose; High Frequency
  • Core Material: Ceramic
  • Technology: Multilayer
  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
Precision Chip Inductor -- AL05
from American Accurate Components (AAC)

Compatible with flow or reflow soldering, high SRF, excellent Q [See More]

  • Application: High Frequency; Cellular Telephone, Wireless LAN
  • Core Material: Ceramic
  • Technology: Single Layer Chip
  • Packing Method: Tape Reel
CT1812SMSF Series -- CT1812SMSF-22NK
from Central Technologies

SMD air core inductor, RoHS compliant, additional info available on request [See More]

  • Application: High Frequency
  • Core Material: Air
  • Technology: Wirewound
  • Devices in Package: 1
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Application: High Frequency
  • Core Material: Ferrite
  • Technology: Multilayer
  • Packing Method: Tape Reel; Bulk
CM0603 Series -- CM0603-10N
from The Inter-Technical Group, Inc. (ITG)

· Ceramic base core material for high frequency application. · 0603 footprint, 1.2mm height max. · Custom value and tolerance are available. · Tape & Reel quantity on 7 ” reel: 2,000 pcs [See More]

  • Application: High Frequency
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
ICL Series
from Trigon Components, Inc.

SERIES. ICL. DESCRIPTION. ICL0603, ICL0805. INDUCTANCE RANGE. 1 to 100uH. IDC. 100 to 1100mA. DCR. 0.13 to 7.50ohm. PACKAGE. SMD 0603, 0805. FEATURE. •Lower profile,High frequency. •Higher possible SRFs as well as excellent Q Value. •Higher current in compact size. •Customer... [See More]

  • Application: High Frequency
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
LMCI 0201 Series -- LMCI0201-10N
from VENKEL LTD.

Low inductance, monolithic structure, excellent solderability [See More]

  • Application: General Purpose; High Frequency
  • Core Material: Ceramic
  • Technology: Multilayer
  • Devices in Package: 1