Tape Reel Chip Inductors Datasheets

Miniature Low-Profile Power Inductor MIL-PRF-27
from Data Device Corporation (DDC)

Beta's BPI series inductors provide high power and high performance in a miniature sized package, designed to meet the SWaP requirements of today's military and industrial applications. Drop-in Pin for Pin Replacement for Pico Electronics: 40000 series. 41000 series. 42000 series. 43000 series [See More]

  • Packing Method: Tape Reel (optional feature)
  • Application: Power Choke
  • Molded / Shielded: Molded
  • Standards and Certifications: RoHS
Adjustable Inductors -- TKS2258CT-ND [614BN-9220Z=P3 from Toko America, Inc.]
from Digi-Key Electronics

INDUCTOR ADJUSTABLE 22UH SMD [See More]

  • Packing Method: Tape Reel
  • Inductance Tolerance: 5
  • Inductance Range: 22
  • Q Factor: 45
Ceramic Core Wirewound Chip Inductors -- CI Series
from RCD Components, Inc.

CERAMIC CORE WIREWOUND CHIP INDUCTORS. Industry ’s widest range!. 1nH to 10uH, 1%-10%, 0 402-1008 sizes. Non-magnetic ceramic-core design for HF operation. Customized versions available with non-standard values, increased Q & SRF, marking of induc. value, etc. Ferrite core available for... [See More]

  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic; Ferrite (optional feature)
  • Technology: Wirewound
  • Application: High Frequency
Precision Chip Inductor -- AL05
from American Accurate Components (AAC)

Compatible with flow or reflow soldering, high SRF, excellent Q [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Single Layer Chip
  • EIA Case Size: 402
FCB-0603 High Speed -- FCB-0603-H102P
from API Technologies - Electromagnetic Integrated Services

Features. Excellent performance in high current applications. Non-polar, surface mountable. Superior filtering characteristics. Superb ability to withstand transient voltages and surge. Offers exceptional solderability and resistance to solder heat. Available in 0603, 0805, 1205 and 1806 body size. [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 603
  • Technology: Multilayer
  • Molded / Shielded: Molded
CT0402CSF-1N0K
from Central Technologies

Applications include telecommunications equipment, tape & reel packaging [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
Chip Inductor for Critical Applications -- ST376RAA030JLZ
from Coilcraft CPS

■ High SRF and excellent Q values. ■ Tight tolerances, many values at 1%. ■ 31 inductance values from 3.3 to 1200 nH [See More]

  • Packing Method: Tape Reel
  • Devices in Package: 1
  • Core Material: Ceramic
  • EIA Case Size: 1812
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Technology: Multilayer
  • Application: High Frequency
0603AS Series -- 0603AS-010J-01
from Fastron Inductive Components

SMD chip inductor, spot welded, 8mm blister tape on reel [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
SMD Inductors & Ferrite Beads
from KEMET Electronics Corporation

KEMET is proud to introduce ferrite products (inductors) to our product portfolio. Inductors are used in every type of electronic equipment including computers, telecommunication, automotive electronics, military electronics, medical electronics and consumer electronics. Offerings include both... [See More]

  • Packing Method: Tape Reel
  • Standards and Certifications: RoHS
  • Technology: Standard; Wirewound; Multilayer
  • Inductance Range: 1 to 100
High Precision TFL Series -- TFL0510
from Thin Film Technology Corporation

Adjustment free due to tight tolerances, excellent rated current [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 402
  • Devices in Package: 1
  • Application: General Purpose
ICL Series
from Trigon Components, Inc.

SERIES. ICL. DESCRIPTION. ICL0603, ICL0805. INDUCTANCE RANGE. 1 to 100uH. IDC. 100 to 1100mA. DCR. 0.13 to 7.50ohm. PACKAGE. SMD 0603, 0805. FEATURE. •Lower profile,High frequency. •Higher possible SRFs as well as excellent Q Value. •Higher current in compact size. •Customer... [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
CMCC 0805 (2012) Standard Series -- CMCC0805121NT
from VENKEL LTD.

Advanced low DC resistance and high current tolerance [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
Chip Beads -- GBK160808T-102Y-N
from Yageo USA

General Features [See More]

  • Packing Method: Tape Reel
  • Impedance: 1000
  • Inductance Tolerance: 25