Tape Reel Chip Inductors Datasheets

FCB-0603 High Speed -- FCB-0603-H102P
from API Technologies - Electromagnetic Integrated Services

Features. Excellent performance in high current applications. Non-polar, surface mountable. Superior filtering characteristics. Superb ability to withstand transient voltages and surge. Offers exceptional solderability and resistance to solder heat. Available in 0603, 0805, 1205 and 1806 body size. [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 603
  • Technology: Multilayer
  • Molded / Shielded: Molded
Adjustable Inductors -- TKS2258CT-ND [614BN-9220Z=P3 from Toko America, Inc.]
from Digi-Key Corporation

INDUCTOR ADJUSTABLE 22UH SMD [See More]

  • Packing Method: Tape Reel
  • Inductance Tolerance: 5
  • Inductance Range: 22
  • Q Factor: 45
Multilayer Ceramic Inductor -- Model MHI0402C10N
from AEM, Inc.

Monolithic structure, used in high frequency equipment [See More]

  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic
  • Technology: Multilayer
  • EIA Case Size: 402
Precision Chip Inductor -- AL05
from American Accurate Components (AAC)

Compatible with flow or reflow soldering, high SRF, excellent Q [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Single Layer Chip
  • EIA Case Size: 402
CT0402CSF-1N0K
from Central Technologies

Applications include telecommunications equipment, tape & reel packaging [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
Chip Inductor for Critical Applications -- ST376RAA030JLZ
from Coilcraft CPS

■ High SRF and excellent Q values. ■ Tight tolerances, many values at 1%. ■ 31 inductance values from 3.3 to 1200 nH [See More]

  • Packing Method: Tape Reel
  • Devices in Package: 1
  • Core Material: Ceramic
  • EIA Case Size: 1812
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Technology: Multilayer
  • Application: High Frequency
0603AS Series -- 0603AS-010J-01
from Fastron Inductive Components

SMD chip inductor, spot welded, 8mm blister tape on reel [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
Standard CIN-0402 -- CIN-0402-H10D
from Spectrum Advanced Specialty Products

Rugged construction design enables parts to perform in industrial environments. The 61-MPC series is ideally suited for products that must conform to FCC part 15 regulations. Agency approvals: UL recognized, CSA certified, TUV approved (tested and found to be in accordance with VDE 0565 Part 30. [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Multilayer
  • EIA Case Size: 402
CM0603 Series -- CM0603-1N8
from The Inter-Technical Group, Inc. (ITG)

· Ceramic base core material for high frequency application. · 0603 footprint, 1.2mm height max. · Custom value and tolerance are available. · Tape & Reel quantity on 7 ” reel: 2,000 pcs [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
High Precision TFL Series -- TFL0510
from Thin Film Technology Corporation

Adjustment free due to tight tolerances, excellent rated current [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 402
  • Devices in Package: 1
  • Application: General Purpose
ICL Series
from Trigon Components, Inc.

SERIES. ICL. DESCRIPTION. ICL0603, ICL0805. INDUCTANCE RANGE. 1 to 100uH. IDC. 100 to 1100mA. DCR. 0.13 to 7.50ohm. PACKAGE. SMD 0603, 0805. FEATURE. •Lower profile,High frequency. •Higher possible SRFs as well as excellent Q Value. •Higher current in compact size. •Customer... [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
CMCC 0805 (2012) Standard Series -- CMCC0805121NT
from VENKEL LTD.

Advanced low DC resistance and high current tolerance [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
Chip Beads -- GBK160808T-102Y-N
from Yageo USA

General Features [See More]

  • Packing Method: Tape Reel
  • Impedance: 1000
  • Inductance Tolerance: 25