Tape Reel Chip Inductors Datasheets

Miniature Low-Profile Power Inductor MIL-PRF-27
from Data Device Corporation (DDC)

Beta's BPI series inductors provide high power and high performance in a miniature sized package, designed to meet the SWaP requirements of today's military and industrial applications. Drop-in Pin for Pin Replacement for Pico Electronics: 40000 series. 41000 series. 42000 series. 43000 series [See More]

  • Packing Method: Tape Reel (optional feature)
  • Application: Power Choke
  • Molded / Shielded: Molded
  • Standards and Certifications: RoHS
Adjustable Inductors -- TKS2258CT-ND [614BN-9220Z=P3 from Toko America, Inc.]
from Digi-Key Electronics

INDUCTOR ADJUSTABLE 22UH SMD [See More]

  • Packing Method: Tape Reel
  • Inductance Tolerance: 5
  • Inductance Range: 22
  • Q Factor: 45
Ceramic Core Wirewound Chip Inductors -- CI Series
from RCD Components, Inc.

CERAMIC CORE WIREWOUND CHIP INDUCTORS. Industry ’s widest range!. 1nH to 10uH, 1%-10%, 0 402-1008 sizes. Non-magnetic ceramic-core design for HF operation. Customized versions available with non-standard values, increased Q & SRF, marking of induc. value, etc. Ferrite core available for... [See More]

  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic; Ferrite (optional feature)
  • Technology: Wirewound
  • Application: High Frequency
Precision Chip Inductor -- AL05
from American Accurate Components (AAC)

Compatible with flow or reflow soldering, high SRF, excellent Q [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Single Layer Chip
  • EIA Case Size: 402
CT0402CSF-1N0K
from Central Technologies

Applications include telecommunications equipment, tape & reel packaging [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
Chip Inductor for Critical Applications -- ST376RAA030JLZ
from Coilcraft CPS

■ High SRF and excellent Q values. ■ Tight tolerances, many values at 1%. ■ 31 inductance values from 3.3 to 1200 nH [See More]

  • Packing Method: Tape Reel
  • Devices in Package: 1
  • Core Material: Ceramic
  • EIA Case Size: 1812
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Technology: Multilayer
  • Application: High Frequency
0603AS Series -- 0603AS-010J-01
from Fastron Inductive Components

SMD chip inductor, spot welded, 8mm blister tape on reel [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
High Precision TFL Series -- TFL0510
from Thin Film Technology Corporation

Adjustment free due to tight tolerances, excellent rated current [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 402
  • Devices in Package: 1
  • Application: General Purpose
ICL Series
from Trigon Components, Inc.

SERIES. ICL. DESCRIPTION. ICL0603, ICL0805. INDUCTANCE RANGE. 1 to 100uH. IDC. 100 to 1100mA. DCR. 0.13 to 7.50ohm. PACKAGE. SMD 0603, 0805. FEATURE. •Lower profile,High frequency. •Higher possible SRFs as well as excellent Q Value. •Higher current in compact size. •Customer... [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
CMCC 0805 (2012) Standard Series -- CMCC0805121NT
from VENKEL LTD.

Advanced low DC resistance and high current tolerance [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
Chip Beads -- GBK160808T-102Y-N
from Yageo USA

General Features [See More]

  • Packing Method: Tape Reel
  • Impedance: 1000
  • Inductance Tolerance: 25