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FCB-0603 High Speed -- FCB-0603-H102P
from API Technologies Corp - Spectrum Control

Features. Excellent performance in high current applications. Non-polar, surface mountable. Superior filtering characteristics. Superb ability to withstand transient voltages and surge. Offers exceptional solderability and resistance to solder heat. Available in 0603, 0805, 1205 and 1806 body size. [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 603
  • Technology: Multilayer
  • Molded / Shielded: Molded
Arrays, Signal Transformers -- 283-3659-1-ND [VP1-0102-R from Cooper Bussmann, Inc.]
from Digi-Key Corporation

INDUCTOR/TRANSFORMER 6.5UH SMD [See More]

  • Packing Method: Tape Reel
  • Inductance Tolerance: 20
  • Standards and Certifications: RoHS
  • DCR: 0.1450
RF Chip Inductor -- CI 0402 CT 10N
from Magnetic Communication Corp.

Magcom Chip Inductor CI series are wire wound chip inductors widely used in the communication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire wound inductors advance in higher self resonate frequency, better Q factor, and much... [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Inductance Range: 0.0100
TE Connectivity 1-1624094-2 Passive Electronic Components -- 1-1624094-2 [1-1624094-2 from TE Connectivity]
from Powell Electronics, Inc.

Converted to EU RoHS/ELV Compliant Reflow solder capable to 260 °C [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 4.5 x 3.2
  • Technology: Wirewound
  • Molded / Shielded: Molded
Multilayer Ceramic Inductor -- Model MHI0402C10N
from AEM, Inc.

Monolithic structure, used in high frequency equipment [See More]

  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic
  • Technology: Multilayer
  • EIA Case Size: 402
Precision Chip Inductor -- AL05
from American Accurate Components (AAC)

Compatible with flow or reflow soldering, high SRF, excellent Q [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Single Layer Chip
  • EIA Case Size: 402
Chip Inductors LCCM Series Chip Common Mode Filter
from AVX Corporation

FEATURES. • Small wire wound chip inductor with ferrite core and 2 common mode lines. • Highly effective in noise suppression. • High common-mode impedance at noise band an low differential mode impedance at signal band factor. There is almost no distortion in high-speed signals. [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • EIA Case Size: `0805,`1206
CT0402CSF-1N0K
from Central Technologies

Applications include telecommunications equipment, tape & reel packaging [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Technology: Multilayer
  • Application: High Frequency
0603AS Series -- 0603AS-010J-01
from Fastron Inductive Components

SMD chip inductor, spot welded, 8mm blister tape on reel [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
Standard CIN-0402 -- CIN-0402-H10D
from Spectrum Advanced Specialty Products

Rugged construction design enables parts to perform in industrial environments. The 61-MPC series is ideally suited for products that must conform to FCC part 15 regulations. Agency approvals: UL recognized, CSA certified, TUV approved (tested and found to be in accordance with VDE 0565 Part 30. [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Multilayer
  • EIA Case Size: 402
CM0603 Series -- CM0603-1N8
from The Inter-Technical Group, Inc. (ITG)

· Ceramic base core material for high frequency application. · 0603 footprint, 1.2mm height max. · Custom value and tolerance are available. · Tape & Reel quantity on 7 ” reel: 2,000 pcs [See More]

  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Technology: Wirewound
  • Devices in Package: 1
High Precision TFL Series -- TFL0510
from Thin Film Technology Corporation

Adjustment free due to tight tolerances, excellent rated current [See More]

  • Packing Method: Tape Reel
  • EIA Case Size: 402
  • Devices in Package: 1
  • Application: General Purpose
ICL Series
from Trigon Components, Inc.

SERIES. ICL. DESCRIPTION. ICL0603, ICL0805. INDUCTANCE RANGE. 1 to 100uH. IDC. 100 to 1100mA. DCR. 0.13 to 7.50ohm. PACKAGE. SMD 0603, 0805. FEATURE. •Lower profile,High frequency. •Higher possible SRFs as well as excellent Q Value. •Higher current in compact size. •Customer... [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
CMCC 0805 (2012) Standard Series -- CMCC0805121NT
from VENKEL LTD.

Advanced low DC resistance and high current tolerance [See More]

  • Packing Method: Tape Reel
  • Core Material: Ferrite
  • Technology: Wirewound
  • Devices in Package: 1
Chip Beads -- GBK160808T-102Y-N
from Yageo USA

General Features [See More]

  • Packing Method: Tape Reel
  • Impedance: 1000
  • Inductance Tolerance: 25