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Wire Wound Chip Inductor LCWC Series
from AVX Corporation

FEATURES. • Ceramic base provides high SRF. • Ultra-compact inductors provide high Q factors. • High current range available. • Miniature SMD chip inductor for fully automated assembly. • Outstanding endurance from Pull-up force, mechanical shock and pressure. • Tighter... [See More]

  • Technology: Standard
  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • Application: Chip Inductor
CT132SMF -- CT132SMF-09TJ
from Central Technologies

For pagers, cordless phones, high frequency communication products [See More]

  • Technology: Standard
  • Devices in Package: 1
  • Core Material: Air
  • Packing Method: Tape Reel
ILF Series
from Trigon Components, Inc.

SERIES. ILF. DESCRIPTION. Fixed, Economical, Epoxy. INDUCTANCE RANGE. 0.10uH to 39mH. IDC. 15 to 1700mA. DCR. 0.06 to 473ohm. PACKAGE. Radial. FEATURE. •Designed to be compact, small and light-weight. •Coating epoxy resin ensures the humidity resistance for long life. [See More]

  • Technology: Standard
  • Packing Method: Tape Reel; Bulk
  • Devices in Package: 1
  • Molded / Shielded: Molded