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FCB-0603 High Speed -- FCB-0603-H102P
from API Technologies Corp - Spectrum Control

Features. Excellent performance in high current applications. Non-polar, surface mountable. Superior filtering characteristics. Superb ability to withstand transient voltages and surge. Offers exceptional solderability and resistance to solder heat. Available in 0603, 0805, 1205 and 1806 body size. [See More]

  • Technology: Multilayer
  • EIA Case Size: 603
  • Packing Method: Tape Reel
  • Molded / Shielded: Molded
Fixed Inductors -- 1276-6229-1-ND [CIH03T1N8SNC from Samsung Electro-Mechanics]
from Digi-Key Corporation

INDUCTOR MULTILAYER 1.8NH 0201 [See More]

  • Technology: Multilayer
  • Standards and Certifications: RoHS
  • Packing Method: Tape Reel
  • Inductance Range: 0.0018
Multi-Layer Power Inductor -- ELG-TEA Series
from Panasonic

Superior DC Current Bias Characteristics with an Expanded Temperature Range!Panasonic introduces the NEW! ELG-TEA Series Multi-Layer Power Inductor. The ELG-TEA features a small 0805 case size and excellent DC current bias characteristics, driven by Panasonic's proprietary laminating process... [See More]

  • Technology: Multilayer
  • Inductance Range: 0.4700 to 4.7
  • Standards and Certifications: RoHS
  • Rated DC Current: 0.0800 to 1.2
TE Connectivity 1-1624115-0 Inductors -- 1-1624115-0 [1-1624115-0 from TE Connectivity]
from Powell Electronics, Inc.

Inductor; 3670 Series; Inductance = .22 µH; DC Resistance = .5 Ω; Current, Maximum = 250 mA; [See More]

  • Technology: Multilayer
  • EIA Case Size: 2.0 x 1.25
  • Packing Method: Tape Reel
  • Application: High Frequency
Multilayer Ceramic Inductor -- Model MHI0402C10N
from AEM, Inc.

Monolithic structure, used in high frequency equipment [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel (optional feature); Bulk (optional feature)
  • Core Material: Ceramic
  • EIA Case Size: 402
CTCB-Power -- CTCB0402F-100P
from Central Technologies

Applications include noise suppression, telecommunication equipment [See More]

  • Technology: Multilayer
  • Devices in Package: 1
  • Core Material: Ferrite
  • Packing Method: Tape Reel
EFH Series -- EFH1608 - 10N
from Excel Cell Electronic USA Corp.

High SRF & Q at high frequency, monolithic inorganic material construction [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel; Bulk
  • Core Material: Ferrite
  • Application: High Frequency
Standard CIN-0402 -- CIN-0402-H10D
from Spectrum Advanced Specialty Products

Rugged construction design enables parts to perform in industrial environments. The 61-MPC series is ideally suited for products that must conform to FCC part 15 regulations. Agency approvals: UL recognized, CSA certified, TUV approved (tested and found to be in accordance with VDE 0565 Part 30. [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel
  • Core Material: Ceramic
  • EIA Case Size: 402
CP1008 Series -- CP1008-1R0M
from The Inter-Technical Group, Inc. (ITG)

Features: �� 1008 foot print Power Chip inductor. �� Low profile - 0.90 mm Max. height. �� Ideal for portable, Mobile & high density board design. �� Suitable for 1Mhz to 100Mhz frequency application. �� Suitable for IR reflow... [See More]

  • Technology: Multilayer
  • Packing Method: Tape Reel
  • Devices in Package: 1
  • EIA Case Size: 1008
IMCG Series
from Trigon Components, Inc.

SERIES. IMCG. DESCRIPTION. Multilayer, General Purpose. INDUCTANCE RANGE. 0.047 to 10uH. IDC. 15 to 300mA. DCR. 0.15 to 1.15ohm. PACKAGE. SMD 0402 to 1206. FEATURE. •To prevent EMI interference noises between. •High Q and high reliability and ferrite material. [See More]

  • Technology: Multilayer
  • Devices in Package: 1
  • Core Material: Ferrite
  • Packing Method: Tape Reel; Bulk
LMCI 0201 Series -- LMCI0201-10N
from VENKEL LTD.

Low inductance, monolithic structure, excellent solderability [See More]

  • Technology: Multilayer
  • Devices in Package: 1
  • Core Material: Ceramic
  • Packing Method: Tape Reel
Multilayer Chip Inductors -- CL100505T-10NM-N
from Yageo USA

General Features [See More]

  • Technology: Multilayer
  • Inductance Range: 0.0100
  • Packing Method: Tape Reel
  • Inductance Tolerance: 20