Advanced MicroSensors, Inc.
from Advanced MicroSensors, Inc.

AMS is located in Shrewsbury, Massachusetts, 35 miles west of Boston [See More]

  • Capabilities: 2D / Surface; 3D / Bulk; CVD; Dry Etching (Plasma / RIE); Inspection / Testing; Plating; Metallization - Thin Film; Photolithography; Wet / Chemical Etching; Magnetic Materials AMR GMR
  • Services: Design; Prototyping; Pilot / Scale-Up; Production; R & D / Development
  • Company Information: AMS works with customers worldwide to design, develop and manufacture wafer-based products. They specialize in MEMS/MST technology and products using magnetic materials and offer great flexibility in substrates, materials and customized solutions.
  • Materials: Silicon; Ceramic; Compound Semiconductor; Glass; Quartz; SOI; Substrates with Active Circuitry
Integrated Sensing Systems, Inc.
from Integrated Sensing Systems, Inc.

Located in Ypsilanti, MI [See More]

  • Capabilities: 2D / Surface; 3D / Bulk; CVD; Dry Etching (Plasma / RIE); Inspection / Testing; Plating; Metallization - Thin Film; Oxidation / Doping; Packaging / Backend Processing; Photolithography; Metallization - Thick Film; Wafer Bonding; Wet / Chemical Etching
  • Services: Design; Prototyping; Pilot / Scale-Up; Production; R & D / Development
  • Company Information: At ISSYS, they specialize in designing and developing innovative products based on high performance MEMS. ISSYS' services range from single-step processing to prototyping to qualified second source to full manufacturing to technical consulting.
  • Materials: Silicon; Compound Semiconductor; Glass; Quartz; SOI
Universal Semiconductor, Inc.
from Universal Semiconductor, Inc.

Located in San Jose, CA [See More]

  • Capabilities: 2D / Surface; 3D / Bulk; CVD; Dry Etching (Plasma / RIE); Inspection / Testing; LIGA; Plating; Metallization - Thin Film; Oxidation / Doping; Packaging / Backend Processing; Photolithography; Wafer Bonding; Wet / Chemical Etching
  • Services: Design; Prototyping; Pilot / Scale-Up; Production; R & D / Development
  • Company Information: USI offers foundry services with 3", 4", 5" and 6" capability. Additionally, USI offers Design Engineering, Manufacturing and Testing capability for wide ranging MEMs products and devices and for various applications.
  • Materials: Silicon; Ceramic; Compound Semiconductor; Glass; Metal; Polymer / Organic; Quartz; SOI