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High Density Low Profile Connectors - HDLP Series -- HDLPxx030
from Hypertac

HDLP Seriess. The HDLP range is a high density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. HDLP connectors offer environmental protection when mated through the use of an interfacial seal and... [See More]

  • Termination Types: Through Hole PC Mount (optional feature); PCBSolder (optional feature)
  • Contact Plating: Gold
  • Contacts Pitch: 1.3mm
  • Contact Rows: 4
EdgeLine -- 0467200016
from Molex

0.80 mm Pitch EdgeLine CoEdge Connector, 108 Circuits, PCB Mating Thickness 1.57mm [See More]

  • Termination Types: Through Hole PC Mount
  • Contact Plating: Gold; Nickel
  • Contacts Pitch: 0.80mm
  • Geometry: Straight
Card Edge Surface Mount Micro-D Connectors
from Omnetics Connector Corporation

Omnetics Micro-D Connectors are ideal for critical, high reliability industries including aerospace, military, and medical. They are also used in devices such as: Optics, guidance systems, on-board equipment, Space and UAV systems. They are built to meet or exceed the specifications of... [See More]

  • Termination Types: Solder Cup or Solder; Through Hole PC Mount
  • Contact Rows: Single; Dual
  • Contacts Pitch: 0.635 mm (0.025'')
  • Geometry: RightAngle
Connectors & Receptacles -- 210 Series
from RDI, Inc.

PBT thermoplastic 30% glass fiber [See More]

  • Termination Types: Through Hole PC Mount
  • Number of Contacts: 1 to 40
  • Contact Rows: Single (optional feature); Dual (optional feature); Triple Row
  • Voltage Rating: 250
Edge Rate™ Rugged, High Speed Interconnects -- ERF8-RA Series
from Samtec Inc.

Avialable on 10, 13, 30, 25, 30, 40 and 50 Pins Per Row. Double Row. Selective Gold Plating [See More]

  • Termination Types: Through Hole PC Mount
  • Contact Plating: Silver (optional feature); Aluminum
  • Contacts Pitch: 0.8 mm
  • Contact Rows: Single
DIGI-KLIP DRP Series -- DRP100
from Components Corporation

The DIGI-KLIP DRP series conforms to the popular .200" row spacing grid. This standardization allows the designer the confidence to apply the unique advantages of the DRP series without the concern over sole sourcing, and many existing products may be re-designed to incorporate this superior contact... [See More]

  • Termination Types: Through Hole PC Mount
  • Contact Plating: Gold (optional feature); Electro Tin
  • Contacts Pitch: 2.54 mm (0.100")
  • Contact Rows: Dual
EBB-PH23 Series -- EBB-PH23-PA
from Excel Cell Electronic USA Corp.

Board to board connectors, embossed type available [See More]

  • Termination Types: Through Hole PC Mount
  • Contact Plating: Gold; Nickel; Tin-Lead Over Ni
  • Contacts Pitch: 1.27 mm (0.05'')
  • Contact Rows: Single