LNP Konduit Thermally Conductive Resin -- OTF2B
from SABIC

Konduit* compounds were the first thermally conductive composites commercially available. From 10 to 50 times more thermally conductive than conventional unfilled thermoplastics, Konduit compounds can conduct heat away from devices into a heat sink or the surrounding air, designed to extend product... [See More]

  • Chemical System: Polysulphide or Polyphenylene Sulphide
  • Resins & Compounds: Pellets; MoldingCompound
  • Filler: Glass or FRP
  • Industry: Aerospace; Automotive; Marine; Sanitary; Repair or Construction; OEM or Industrial; Packaging
OC Meldin® 1277
from Saint-Gobain Oil & Gas

Specify Meldin 1277 when the product requirements call for structural integrity and low deformation. This material also exhibits good electrical insulative properties and dimensional stability. [See More]

  • Chemical System: Polysulphide or Polyphenylene Sulphide
  • Industry: OEM or Industrial
  • Filler: Unfilled
  • Use Temperature: 250
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FORTRON 0205 -- 326
from Ticona Engineering Polymers

FORTRON should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 30 ° C. The time between drying and processing should be as short as possible. [See More]

  • Chemical System: Polysulphide or Polyphenylene Sulphide
  • Resins & Compounds: MoldingCompound
  • Filler: LOW VISCOSITY, UNFIL
  • Use Temperature: 230 to 248
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