Electrical -- E2001
from Epoxy Technology

EPO-TEK ® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
EP21FLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio... [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Ultramid® Seal-Fit
from BASF USA Corporation

Anti-lock braking systems, airbag control, plug connection [See More]

  • Filler: Metal or MIM
  • Chemical System: Polyurethane
  • Type: MoldingCompound
  • Form / Shape: Pellets
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid