Metal Thermosets and Thermoset Resins Datasheets

Electrically Conductive Epoxy -- EPO-TEK® E4110-PFC
from Epoxy Technology

A two component, silver-filled thixotropic epoxy for fine pitch applications in semiconductor flip chip or SMD microelectronic assemblies. Screen-printed "bumps" of EPO-TEK ® E4110-PFC can be the size of 80 µm diameter on 125 µm pitch. It is a more thixotropic version of EPO-TEK ® E4110. [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
Two Component, Epoxy Resin Systems -- EP21LSCL
from Master Bond, Inc.

Master Bond Polymer System EP21LSCL is a two component, low viscosity epoxy resin system featuring optical clarity and non-yellowing properties for high performance coating, bonding, sealing and casting. It is formulated to cure easily at room temperatures or more quickly at elevated temperatures. [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid