Filler Material:Other Thermosets and Thermoset Resins Datasheets

Electrically Conductive Epoxy -- EJ2189
from Epoxy Technology

Product Description : EPO - TEK ® E J2189 is an electrically conductive, silver - filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. EPO - TEK ® EJ2189 Advantages & Application Notes :... [See More]

  • Filler: Silver
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
Bayflex® RIM System -- BAYFLEX 110-35 IMR
from Covestro LLC

The Bayflex 110-35 IMR system produces a solid. urethane elastomer which has a flexural modulus of. approximately 33,500 psi* at room temperature. This. system is used to provide multiple releases of large. reaction injection molding (RIM) parts, such as. automotive fascias. The system contains... [See More]

  • Filler: Unfilled (optional feature); Glass or FRP (optional feature); Mineral or Inorganic (optional feature); 15% Wollastonite
  • Form / Shape: Liquid
  • Type: MoldingCompound
  • Industry: Automotive; Reaction Injection Molding
Electrical Barrier Material -- Voltoid™ D-800
from Interface Performance Materials

Voltoid ® D-800 is a resin-bonded cellulose fiber composite material. It is formulated for consistent electrical and mechanical performance under variable humidity and moisture conditions, and is recognized by UL for continuous use up to 105 oC. [See More]

  • Filler: Cellulose Fiber Composite
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: CastingResin
  • Industry: Electrical Power or High Voltage; OEM or Industrial
Meldin® Polyimide Material -- 2030
from Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs

The Meldin 2030 bearing compound operates with extremely low friction in both dynamic and static applications and provides thermal and electrical insulation. [See More]

  • Filler: PTFE
  • Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
  • Chemical System: Bismaleimide (BMI)
  • Features: Thermal Insulation
Molding Compound -- ZeMC² 3033HT
from Zeon Technologies, Inc.

We are also developing a line of bulk molding compounds through ZeMC ²,our sister company, that are second to none in the industry. We already have in the market place, through Carver Pump Composites, a Kevlar molding compound for high temperature pump seals that are virtually indestructible... [See More]

  • Filler: Kevlar
  • Chemical System: Epoxy
  • Type: MoldingCompound
  • Form / Shape: Pellets