Optoelectronics Thermosets and Thermoset Resins Datasheets

Optical -- 301
from Epoxy Technology

Product Description: EPO-TEK ® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. EPO-TEK ® 301 Advantages & Suggested Application Notes: • Semiconductor: optical glob top or underfill; adhesion to common... [See More]

  • Industry: Optoelectronics or Photonics
  • Chemical System: Epoxy
  • Type: Optical; CastingResin
  • Filler: Unfilled
High Performance, Two Component Self-leveling Construction Joint Sealant -- EP30DP8F1
from Master Bond, Inc.

Master Bond Polymer System EP30DP8F1 is a high performance two component construction joint sealant specially formulated to give easy application and long, trouble free service on horizontal traffic and deck joints. It furnishes joints ample freedom to expand and contract, seals on moisture,... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin
  • Form / Shape: Liquid
Hysol® Optoelectronic Material -- MG17-0604
from Henkel Corporation - Electronics

Good moisture resistance and thermal shock resistance [See More]

  • Industry: Electronics; Optoelectronics or Photonics
  • Filler: Unfilled
  • Type: Optical; MoldingCompound
  • CTE: ? to 19
CR-39® Monomer -- H-911
from Homalite

Low-reflectance surface finish available, chemical, abrasion resistant [See More]

  • Industry: Electronics; Optoelectronics or Photonics; OEM or Industrial; Electronic Display Windows
  • Filler: Unfilled
  • Type: Optical
  • Use Temperature: ? to 150