Semiconductor / IC's Thermosets and Thermoset Resins Datasheets

Electrically Conductive Adhesive -- EPO-TEK® E3035
from Epoxy Technology

A single component, thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging. This is a non-military version of EPO-TEK ®... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: CastingResin
  • Filler: Unfilled
Electrically Insulative, Two Component Epoxy System -- EP30M3LV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin
  • Form / Shape: Liquid
Perfluoroelastomer -- 3M™ Dyneon™ PFE 131TX
from 3M Advanced Materials Division

3M ™ Perfluoroelastomers (FFKMs) are fully fluorinated high performance elastomers, typically used in the most extreme chemical environments, when no other class of elastomers can meet the desired performance criteria. Product Features. Best overall chemical resistance. Broadest temperature... [See More]

  • Industry: Aerospace; Marine; OEM or Industrial; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Chemical System: Fluoropolymer
  • Use Temperature: 20 to 600