Thermally Insulating Thermosets and Thermoset Resins Datasheets

Thermal -- H55
from Epoxy Technology

A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: CastingResin
  • Filler: Unfilled
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Optical; CastingResin
  • Form / Shape: Liquid
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: CastingResin
  • Filler: Unfilled
OG Meldin® 2001
from Saint-Gobain Oil & Gas

This material is best suited for thermal and electrical insulation and radiation resistance. Meldin 2001 has the highest compressive properties of any material in the series. [See More]

  • Features: Thermal Insulation
  • Filler: Unfilled
  • Chemical System: Bismaleimide (BMI)
  • Industry: OEM or Industrial
Meldin® Polyimide Material -- 2001
from Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs

This material is best suited for thermal and electrical insulation and radiation resistance. Meldin 2001 has the highest compressive properties of any material in the series. [See More]

  • Features: Thermal Insulation
  • Filler: Unfilled
  • Chemical System: Bismaleimide (BMI)
  • Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial