Semiconductor / IC's Elastomers and Rubber Compounds Datasheets

High Performance, Two Component Self-leveling Construction Joint Sealant -- EP30DP8F1
from Master Bond, Inc.

Master Bond Polymer System EP30DP8F1 is a high performance two component construction joint sealant specially formulated to give easy application and long, trouble free service on horizontal traffic and deck joints. It furnishes joints ample freedom to expand and contract, seals on moisture,... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Type / Grade: Thermally cured
  • Resins and Compounds: CastingResin
  • Form / Shape: Liquid
Perfluoroelastomer -- 3M™ Dyneon™ PFE 01C
from 3M Advanced Materials Division

3M ™ Perfluoroelastomers (FFKMs) are fully fluorinated high performance elastomers, typically used in the most extreme chemical environments, when no other class of elastomers can meet the desired performance criteria. Product Features. Best overall chemical resistance. Broadest temperature... [See More]

  • Industry: Aerospace; Marine; OEM or Industrial; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Chemical System: Fluoropolymer
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Industry: Aerospace; Electronics; Semiconductors or IC Packaging
  • Chemical System: Silicone
  • Form / Shape: Liquid
  • Filler: Unfilled
Isolast® Fab Range™ -- J9610
from Trelleborg Sealing Solutions

Hardness of 75 ± 5 Shore A, black, long term low compression set [See More]

  • Industry: Semiconductors or IC Packaging
  • Use Temperature: -13 to 455
  • Filler: Unfilled
  • Tensile (Break): 2002