Semiconductor / IC's Casting Resins Datasheets

Electrically Conductive Adhesive -- EPO-TEK® E3035
from Epoxy Technology

A single component, thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging. This is a non-military version of EPO-TEK ®... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Filler: Unfilled
Electrically Insulative, Two Component Epoxy System -- EP30M3LV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Use Temperature: -60 to 250