Thermally Insulating Casting Resins Datasheets

Thermal -- H55
from Epoxy Technology

A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Filler: Unfilled
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured; Optical
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Filler: Unfilled