Thermal -- H55
from Epoxy Technology

A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured
  • Filler: Unfilled
EP30-1
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Features: Thermal Insulation
  • Chemical System: Epoxy
  • Type: Thermally cured; Optical
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working