EP21FLVSP
from Master Bond, Inc.
from Master Bond, Inc.
Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio... [See More]
- Filler: Metal or MIM
- Chemical System: Epoxy
- Material Type: Thermally cured; CastingResin
- Features: Anti-static or ESD Control; Thermally Conductive; Electrically Conductive Compound; EMI / RFI Shielding Material
LNP Faradex Stainless Steel Fiber Resin -- WX94736
from SABIC
from SABIC
Faradex* compounds provide electromagnetic and radio frequency interference (EMI/RFI) attenuation in applications from electronics to material handling. Conductive fibers form the conductive network required for EMI/RFI shielding. Faradex compounds can also be used in applications where... [See More]
- Filler: Metal or MIM
- Chemical System: Polybutylene Terephalate
- Material Type: Thermoplastic; MoldingCompound
- Form / Shape: Pellets
